tza3017hw NXP Semiconductors, tza3017hw Datasheet - Page 45
tza3017hw
Manufacturer Part Number
tza3017hw
Description
30 Mbits/s Up To 3.2 Gbits/s A-rate Fibre Optic Transmitter
Manufacturer
NXP Semiconductors
Datasheet
1.TZA3017HW.pdf
(52 pages)
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Philips Semiconductors
PACKAGE OUTLINE
2003 May 14
HTQFP100: plastic thermal enhanced thin quad flat package; 100 leads;
body 14 x 14 x 1 mm; exposed die pad
30 Mbits/s up to 3.2 Gbits/s
A-rate fibre optic transmitter
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
E h
OUTLINE
VERSION
SOT638-1
max.
100
76
1.2
A
75
y
1
0.15
0.05
A 1
exposed die pad side
1.05
0.95
A 2
e
pin 1 index
0.25
A 3
IEC
b p
H D
0.27
0.17
D h
b p
D
0.20
0.09
w
c
M
D
14.1
13.9
JEDEC
(1)
Z D
0
D h
7.1
6.1
REFERENCES
X
25
51
14.1
13.9
E
50
26
(1)
Z E
E h
7.1
6.1
B
JEITA
b p
scale
45
w
e
v
v
M
0.5
c
M
M
e
B
A
E
A
16.15
15.85
H D
H E
16.15
15.85
H E
10 mm
A
A 2
L
1
A 1
detail X
0.75
0.45
L p
PROJECTION
0.2
EUROPEAN
v
0.08
w
0.08
TZA3017HW
y
Product specification
Z D
1.15
0.85
ISSUE DATE
L
(1)
L p
01-03-30
03-04-07
Z E
1.15
0.85
SOT638-1
(1)
(A 3 )
7
0
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