tza3044 NXP Semiconductors, tza3044 Datasheet
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tza3044
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tza3044 Summary of contents
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... DATA SHEET TZA3044; TZA3044B SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers Product specification Supersedes data of 1999 Mar 16 File under Integrated Circuits, IC19 INTEGRATED CIRCUITS 1999 Nov 03 ...
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... Gigabit Ethernet applications Wideband RF gain block. GENERAL DESCRIPTION The TZA3044 is a high gain limiting amplifier that is designed to process signals from fibre optic preamplifiers like the TZA3043 and TZA3023 pin compatible with the NE/SA5224 and NE/SA5225 but with extended power supply range, and needs less external components ...
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... JAM (18 (17) 9 STQ (27, 28 CCD MGR240 SUB 1 16 RSET TEST ref AGND CCD DIN 4 13 DOUT TZA3044TT TZA3044BTT 5 12 DINQ DOUTQ V CCA 6 11 DGND STQ JAM MBK998 Pin configuration of TZA3044TT and TZA3044BTT. ...
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... HIGH; complementary to pin ST O PECL-compatible status output of the input signal level detector (TTL compatible for the TZA3044B); when the input signal is below the user-programmed threshold level, this output is LOW; complementary to pin STQ S digital ground; must be at the same potential as pin AGND O PECL-compatible differential output ...
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... Therefore a DC offset compensation circuit is implemented in the TZA3044, which keeps the input of buffer A3 at its toggle point in the absence of any input signal. An input signal level detection is implemented to check if the input signal is above the user-programmed level ...
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... For the TZA3044T (SO package), the worst case die temperature T the maximum operating temperature. and CCA For the TZA3044TT (TSSOP package), the worst case die temperature T than the maximum operating temperature, and therefore strongly discouraged recommended to lower the thermal resistance from junction to ambient, e.g. by means of a dedicated board layout ...
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... Output signal on pin DOUTQ or pin STQ; complementary to output signal (1) handbook, halfpage 1999 Nov 03 (1) (2) MGS812 Fig.4 Logic level symbol definitions for PECL DIN 4 MGR958 Fig.5 Data input circuit DIN and DINQ. 7 Product specification TZA3044; TZA3044B OH(max) V OH(min) V OL(max) V OL(min) GND DINQ 4.5 k ...
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... Gbits/s Gigabit Ethernet postamplifiers handbook, halfpage 1.5 V RSET CCA handbook, full pagewidth V LOW Output STQ is complementary to output ST. Fig.7 Output circuit ST and STQ for the TZA3044 (left) and TZA3044B (right). handbook, halfpage 1999 Nov 03 V CCA R ADJ RSET V RSET TZA3044 I RSET MGS815 Fig ...
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... Nov 3 127 82.5 GND 5 83 125 GND Fig.9 PECL output termination schemes. 9 Product specification TZA3044; TZA3044B MGR248 R1 = 127 R2 = 82.5 MGR249 125 MGR250 ...
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... Note 1. For the TZA3044B the minimum value is 0.5 V for ST and STQ outputs. HANDLING This device is ESD sensitive and should be handled with care. Precautions should be taken to avoid damage through electrostatic discharge. This is particularly important during assembly and handling of the bare die. Additional safety can ...
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... CCA V = 1.25 Gbits/s PRBS sequence; note 5 electrically measured note 5 0.5 note note 20% to 80%; note 5 80% to 20%; note 5 note 5 note 9 11 Product specification TZA3044; TZA3044B MIN. TYP. MAX. 3.3 5 110 300 +125 +25 +85 1.5 3.0 2.1 V CCA 4.5 7.6 2 ...
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... connected to a level Large signal response of TZA3044T and TZA3044TT show very little deviation, although the small signal frequency response of the TZA3044TT is more flat and shows a larger bandwidth. 10. Internal pull-down resistor of 500 k to DGND. 11. Internal series resistor 1999 Nov 03 ...
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... Fig.11 Differential output voltage as function of MGR961 260 handbook, halfpage t (ps) 220 180 140 100 i(dif)(p-p) (V) Fig.13 Differential output rise time and fall time as 13 Product specification TZA3044; TZA3044B DOUT DOUTQ junction temperature ...
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... ( pattern PRBS pattern. Fig.17 Status detect hysteresis as function of 14 Product specification TZA3044; TZA3044B MGR964 (1) (2) (3) ( RSET ( DINQ 7 1 PRBS pattern (pin ST = HIGH PRBS pattern (pin ST = LOW). ...
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... MGR969 1.555 handbook, halfpage V RSET (V) 1.545 1.535 1.525 RSET ( ( function of PWD Fig. Product specification TZA3044; TZA3044B (1) ( RSET ( A) I RSET where V = input low threshold (pin ST = LOW). = ------------- - i(dif dif 1 PRBS pattern. (1) ( ...
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... Gbits/s Gigabit Ethernet postamplifiers handbook, full pagewidth 200 mV/div Fig.22 Differential output waveform with 4 mV differential input voltage. handbook, full pagewidth 200 mV/div Fig.23 Differential output waveform with 2 V differential input voltage. 1999 Nov 03 TZA3044; TZA3044B MGR956 MGR957 16 Product specification ...
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... TZA3044 (1, 14) (16) (17) (18) (19, 20, 22, 25 AGND SUB JAM STQ ST Fig.24 Application diagram. 17 Product specification TZA3044; TZA3044B 100 nF V CCD DOUT (24) 13 data out DOUTQ (23) 12 DGND level detect status MGR251 ...
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... MHz GND GND GND (1) Ferrite bead e.g. Murata BLM10A700S. The numbers in brackets refer to the pad numbers of the bare die version. Fig.25 Gigabit Ethernet receiver using the TZA3043T and TZA3044 680 nF (1) 100 RSET CF V CCA 16 ...
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... GND GND GND 7.5 pF optional noise filter: 3-pole, 470 MHz Bessel (1) Ferrite bead e.g. Murata BLM10A700S. The numbers in brackets refer to the pad numbers of the bare die version. Fig.26 STM4/OC12 receiver using the TZA3023T and TZA3044 680 nF (1) 100 RSET CF V CCA ...
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... Fig.27). 1999 Nov 03 ( +647.8 +647.8 +647.8 +507.1 +350.0 +210.0 +70.0 70.0 210.0 350.0 507.1 647.8 647.8 647.8 78.6 647.8 647.8 647.8 647.8 647.8 507.1 350.0 210.0 70.0 +70.0 +210.0 +350.0 +507.1 +647.8 +647.8 +647.8 +647.8 78.6 +647.8 20 Product specification TZA3044; TZA3044B ...
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... AGND AGND (1) 1.55 mm DINQ AGND TEST V CCA (1) Typical value. Fig.27 Bonding pad locations of TZA3044U and TZA3044BU. Physical characteristics of bare die PARAMETER Glass passivation 2.1 m PSG (PhosphoSilicate Glass) on top of 0.65 m oxynitride Bonding pad dimension minimum dimension of exposed metallization is 90 Metallization 1.22 m W/AlCu/TiW Thickness 380 m nominal Size 1 ...
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... 2.5 scale (1) ( 0.49 0.25 10.0 4.0 6.2 1.27 0.36 0.19 9.8 3.8 5.8 0.0100 0.39 0.16 0.244 0.050 0.0075 0.38 0.15 0.228 REFERENCES JEDEC EIAJ MS-012AC 22 Product specification TZA3044; TZA3044B detail 1.0 0.7 1.05 0.25 0.25 0.1 0.4 0.6 0.039 0.028 0.041 0.01 0.01 0.004 0.016 ...
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... Nov 2.5 scale (1) ( 0.2 5.1 4.5 6.6 0.65 0.1 4.9 4.3 6.2 REFERENCES JEDEC EIAJ MO-153 23 Product specification TZA3044; TZA3044B detail 0.75 0.4 1.0 0.2 0.13 0.1 0.50 0.3 EUROPEAN ISSUE DATE PROJECTION SOT403-1 ( ...
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... If wave soldering is used the following conditions must be observed for optimal results: 1999 Nov 03 TZA3044; TZA3044B Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch (e): – ...
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... Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm. 1999 Nov 03 SOLDERING METHOD WAVE not suitable (2) suitable (3)(4) not recommended (5) not recommended 25 Product specification TZA3044; TZA3044B (1) REFLOW suitable suitable suitable suitable suitable ...
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... Accordingly, Philips Semiconductors assumes no liability for device functionality or performance of the die or systems after handling, packing or assembly of the die the responsibility of the customer to test and qualify their application in which the die is used. 1999 Nov 03 TZA3044; TZA3044B 26 Product specification ...
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... Philips Semiconductors SDH/SONET STM4/OC12 and 1.25 Gbits/s Gigabit Ethernet postamplifiers 1999 Nov 03 TZA3044; TZA3044B NOTES 27 Product specification ...
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Philips Semiconductors – a worldwide company Argentina: see South America Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140, Tel. +61 2 9704 8141, Fax. +61 2 9704 8139 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. + 101 ...