tza3047a NXP Semiconductors, tza3047a Datasheet - Page 21

• Manufacturer Part Number: tza3047a
• Description: 30 Mbits/s Up To 1.25 Gbits/s Laser Drivers
• Manufacturer: NXP Semiconductors

Philips Semiconductors
13 BONDING PAD LOCATIONS
2003 Jun 05
V
V
V
V
DIN
DINQ
GNDRF
GNDRF
GNDRF
GNDRF
TEST
CIN
CINQ
GNDESD
ALRESET
ENABLE
GNDDFT
ALOP
ALMON
i.c.
MAXOP
i.c.
VTEMP
MAXMON
RREF
GNDRF
PWA
GNDO
LAQ
LAQ
LAQ
LAQ
GNDO
i.c.
GNDO
GNDO
LA
i.c.
CCA
CCA
CCD
CCD
30 Mbits/s up to 1.25 Gbits/s laser drivers
SYMBOL
PAD
22
34
38
20
10
11
12
13
14
21
23
24
25
26
27
28
29
30
31
32
33
35
36
37
15
16
17
18
19
1
2
3
4
5
6
7
8
9
(2)(3)
(4)
(4)
(4)
(4)
+1098.9
+1099.0
+1099.0
+1099.0
+1099.0
+1099.0
+1099.8
+1099.8
+1099.8
1099.1
+294.0
+466.9
+694.9
+860.3
+839.0
1123.9
1123.9
1123.9
1123.9
1124.0
1124.9
1123.9
1123.9
1123.9
1123.9
1123.4
1123.9
1123.9
1123.9
1123.9
839.0
221.5
829.8
665.6
504.9
267.6
98.5
48.6
COORDINATES
x
+1029.3
+949.3
+844.3
+764.3
+604.3
+393.3
+244.5
+139.4
1124.3
1124.2
1124.2
1124.0
1124.0
1123.7
1124.0
1124.3
105.4
179.6
+4.7
100.3
253.4
441.2
697.1
850.8
991.4
344.4
368.4
979.4
829.7
691.2
611.2
506.4
426.4
247.0
194.4
142.0
1124
36.8
(1)
y
21
Notes
1. All coordinates are referenced (in m) to the centre of
2. All GND connections should be used.
3. Recommended order of bonding: all GND first, then
4. Pad is internally connected, do not use.
LA
LA
LA
GNDO
BIAS
V
V
ACDC
GNDESD
MON
BIASIN
BIASOUT
GNDCCB
MODIN
GNDCCB
i.c.
MODOUT
ER
AVR
CCO
CCO
SYMBOL
the die.
V
and output pins.
CCA
, V
CCD
and V
PAD
54
39
40
41
42
43
44
45
46
47
48
49
50
51
52
53
55
56
57
TZA3047A; TZA3047B
(2)(3)
(4)
CCO
supplies and finally the input
1099.1
1099.1
1099.1
1099.1
1099.0
1099.0
1099.0
942.5
765.0
602.1
431.7
267.6
100.8
241.1
274.4
487.2
645.6
802.8
82.7
COORDINATES
x
Product specification
+1123.8
+1123.8
+1123.8
+1123.8
+1123.8
+954.4
1024.4
1124.3
1123.8
1123.7
1123.8
1123.8
1123.8
185.4
290.5
370.5
670.8
804.8
944.4
(1)
y