tza3050 NXP Semiconductors, tza3050 Datasheet - Page 4

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tza3050

Manufacturer Part Number
tza3050
Description
Tza3050 30 Mbits/s Up To 1.25 Gbits/s Burst Mode Laser Driver
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
6. Pinning information
9397 750 14806
Product data sheet
6.1 Pinning
6.2 Pin description
Table 2:
Symbol
GND
V
V
DIN
DINQ
TEST
CIN
CINQ
GND
ALRESET
ENABLE
ALOP
ALMON
MAXOP
VTEMP
Fig 2. Pin configuration
CCA
CCD
Pin description
Pin
die pad
1
2
3
4
5
6
7
8
9
10
11
12
13
14
V
TEST
V
DINQ
CINQ
GND
CCD
CCA
DIN
CIN
Rev. 03 — 7 April 2005
Description
common ground plane for V
connected to ground
analog supply voltage
digital supply voltage
non-inverted data input (RF input)
inverted data input (RF input)
test pin; must be connected to ground
non-inverted clock input (RF input)
inverted clock input (RF input)
ground
alarm reset input for alarm outputs ALMON and ALOP
enable input for modulation and bias current switch on and off
between bursts
alarm output on operating current (open-drain)
alarm output on monitor diode current (open-drain)
threshold level input for alarm on operating current
temperature dependent voltage output
1
2
3
4
5
6
7
8
9
10
32
30 Mbits/s up to 1.25 Gbits/s burst mode laser driver
11
31
TZA3050VH
12
30
29
13
28
14
15
27
CCA
16
26
, V
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
19
18
17
25
24
23
22
21
20
CCD
mce135
, V
BIAS
GND
LA
LA
LAQ
LAQ
GND
PWA
CCO
, RF and I/O; must be
TZA3050
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