lm2756tmx National Semiconductor Corporation, lm2756tmx Datasheet - Page 4

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lm2756tmx

Manufacturer Part Number
lm2756tmx
Description
Multi-display Inductorless Led Driver With 32 Exponential Dimming Steps In ?smd
Manufacturer
National Semiconductor Corporation
Datasheet
www.national.com
I
V
I
I
f
t
V
I
V
V
V
I
t
t
t
t
t
SD
DxA-B-C /
SET
SW
START
2
2
1
2
3
4
5
Symbol
SET
HWEN
C Compatible Interface Voltage Specifications (SCL, SDIO)
IL
IH
OL
C Compatible Interface Timing Specifications (SCL, SDIO)(Note 13)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation
of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions,
see the Electrical Characteristics tables.
Note 2: All voltages are with respect to the potential at the GND pins.
Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Thermal shutdown engages at T
= 155°C (typ.).
Note 4: For detailed soldering specifications and information, please refer to National Semiconductor Application Note 1112: Micro SMD Wafer Level Chip Scale
Package (AN-1112).
Note 5: The human body model is a 100pF capacitor discharged through a 1.5kΩ resistor into each pin. (MIL-STD-883 3015.7)
Note 6: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be
derated. Maximum ambient temperature (T
dissipation of the device in the application (P
following equation: T
Note 7: Junction-to-ambient thermal resistance is highly dependent on application and board layout. In applications where high maximum power dissipation
exists, special care must be paid to thermal dissipation issues in board design. For more information, please refer to National Semiconductor Application Note
1112: Micro SMD Wafer Level Chip Scale Package (AN-1112).
Note 8: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm.
Note 9: C
IN
Shutdown Supply Current
I
Output Current to Current Set Ratio
GroupA, GroupB, GroupC
Switching Frequency
Start-up Time
HWEN Voltage Thresholds
Input Logic Low "0"
Input Logic High "1"
Output Logic Low "0"
SCL (Clock Period)
Data In Setup Time to SCL High
Data Out stable After SCL Low
SDIO Low Setup Time to SCL Low
(Start)
SDIO High Hold Time After SCL High
(Stop)
SET
, C
VOUT
Pin Voltage
, C
A-MAX
1
, and C
= T
Parameter
J-MAX-OP
2
: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics
– (θ
JA
A-MAX
× P
D-MAX
D-MAX
) is dependent on the maximum operating junction temperature (T
), and the junction-to ambient thermal resistance of the part/package in the application (θ
).
All ENx bits = "0"
2.7V
V
2.7V
2.7V
2.7V
I
(Note 14)
LOAD
OUT
= 90% steady state
= 3.5mA
V
V
V
V
IN
IN
IN
IN
5.5V
5.5V
5.5V
5.5V
4
Condition
Reset
Normal Operation
J-MAX-OP
1.075
1.225
Min
294
100
100
100
1.0
0
0
0
J
= 105°C), the maximum power
= 160°C (typ.) and disengages at T
1.25
Typ
189
250
3.7
1.3
30009713
JA
), as given by the
0.580
0.710
Max
400
5.5
1.6
V
V
IN
IN
Units
MHz
mV
µA
µs
ns
ns
ns
ns
ns
V
V
V
V
J

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