hip2100 Intersil Corporation, hip2100 Datasheet - Page 11

• Manufacturer Part Number: hip2100
• Description: 100 V/2 A Peak High-frequency Half Bridge Driver With Cmos Logic Inputs
• Manufacturer: Intersil Corporation

NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
Small Outline Plastic Packages (SOIC)
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
-C-
E
-B-
B S
A
H
A1
11
µ
α
0.10(0.004)
0.25(0.010)
M
L
h x 45
B
M
o
C
HIP2100
M8.15
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-012-AA ISSUE C)
0.0532
0.0040
0.013
0.0075
0.1890
0.1497
0.2284
0.0099
0.016
MIN
0
0.050 BSC
o
INCHES
8
MAX
0.0688
0.0098
0.020
0.0098
0.1968
0.1574
0.2440
0.0196
0.050
8
o
MILLIMETERS
1.35
0.10
0.33
0.19
4.80
3.80
5.80
0.25
0.40
MIN
0
o
1.27 BSC
8
MAX
1.75
0.25
0.51
0.25
5.00
4.00
6.20
0.50
1.27
8
o
Rev. 0 12/93
NOTES
FN4022.13
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