hip2100 Intersil Corporation, hip2100 Datasheet - Page 9

• Manufacturer Part Number: hip2100
• Description: 100 V/2 A Peak High-frequency Half Bridge Driver With Cmos Logic Inputs
• Manufacturer: Intersil Corporation

SEATING
PLANE
Dual Flat No-Lead Plastic Package (DFN)
Micro Lead Frame Plastic Package (MLFP)
NX b
7
5
2X
INDEX
AREA
2X
INDEX
AREA
6
8
0.15
6
0.15
E2
C
4X
C
C
A
E2/2
0
B
A
A1
BOTTOM VIEW
N
e
1
N
1
FOR EVEN TERMINAL/SIDE
N-1
SIDE VIEW
(Nd-1)Xe
7
2
TOP VIEW
2 3
REF.
3
D2
D1
D
8
D2/2
D1/2
C
D/2
9
C
L C
NX b
2X
e
4X P
A3
0.10
NX k
0.15
A2
E1/2
L
TERMINAL TIP
M
A1
C
C A
A
E1
5
5
A
B
E/2
9
//
0.08
0.10
E
B
2X
C
C
0.15
HIP2100
C
B
L12.4x4A
12 LEAD DUAL FLAT NO-LEAD PLASTIC PACKAGE
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5M-1994.
2. N is the number of terminals.
3. Nd refer to the number of terminals on D.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
6. The configuration of the pin #1 identifier is optional, but must be
7. Dimensions D2 and E2 are for the exposed pads which provide
8. Nominal dimensions are provided to assist with PCB Land Pattern
9. COMPLIANT TO JEDEC MO-229-VGGD-2 ISSUE C except for
SYMBOL
between 0.15mm and 0.30mm from the terminal tip.
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
improved electrical and thermal performance.
Design efforts, see Intersil Technical Brief TB389.
the L dimension.
A1
A2
A3
D1
D2
E1
E2
Nd
D
N
A
b
E
e
L
P
k
θ
0.635
0.00
0.18
2.65
1.43
0.30
0.24
MIN
-
-
-
MILLIMETERS
NOMINAL
0.20 REF
4.00 BSC
3.75 BSC
4.00 BSC
3.75 BSC
0.50 BSC
0.85
0.01
0.65
0.23
2.80
1.58
0.40
0.42
12
6
-
-
MAX
0.90
0.05
0.70
0.30
2.95
1.73
0.50
0.60
12
-
Rev. 0 8/03
FN4022.13
NOTES
5, 8
7, 8
7, 8
8
2
3
-
-
-
-
-
-
-
-
-
-
-
-