hcs112ms Intersil Corporation, hcs112ms Datasheet - Page 9

• Manufacturer Part Number: hcs112ms
• Description: Radiation Hardened Dual Jk Flip-flop
• Manufacturer: Intersil Corporation

Die Characteristics
DIE DIMENSIONS:
METALLIZATION:
GLASSIVATION:
WORST CASE CURRENT DENSITY:
BOND PAD SIZE:
Metallization Mask Layout
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location.
89 x 88 mils
2.25 x 2.24mm
Type: SiAl
Metal Thickness: 11k
Type: SiO
Thickness: 13k
<2.0 x 10
100 m x 100 m
4 mils x 4 mils
The mask series for the HCS112 is TA14341A.
QB (7)
QA (5)
QA (6)
SA (4)
JA (3)
5
2
A/cm
Å
2
2.6k
Å
Å
1k
Å
KA
(2)
GND
(8)
HCS112MS
HCS112MS
CP1
(1)
QB
(9)
19
(10)
SB
VCC
(16)
Spec Number
(15) RA
(14) RB
(13) CPB
(12) KB
(11) JB
518830