lpc2106fhn48/00 NXP Semiconductors, lpc2106fhn48/00 Datasheet - Page 31
![no-image](/images/manufacturer_photos/0/4/487/nxp_semiconductors_sml.jpg)
lpc2106fhn48/00
Manufacturer Part Number
lpc2106fhn48/00
Description
Single-chip 32-bit Microcontrollers; 128 Kb Isp/iap Flash With 64 Kb/32 Kb/16 Kb Ram
Manufacturer
NXP Semiconductors
Datasheet
1.LPC2106FHN4800.pdf
(35 pages)
- Current page: 31 of 35
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Philips Semiconductors
Fig 9. Package outline SOT619-1 (HVQFN48)
LPC2104_2105_2106_6
Product data sheet
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 7 x 7 x 0.85 mm
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT619-1
max.
A
1
(1)
terminal 1
index area
terminal 1
index area
0.05
0.00
A 1
E h
L
12
1
0.30
0.18
b
e
13
48
IEC
- - -
0.2
c
D
7.1
6.9
(1)
5.25
4.95
D h
e 1
D h
D
MO-220
JEDEC
1/2
E
7.1
6.9
e
(1)
REFERENCES
0
Rev. 06 — 25 July 2006
5.25
4.95
b
E h
37
0.5
24
e
JEITA
scale
25
36
2.5
- - -
B
1/2
e
5.5
e 1
e
w
v
A
E
M
M
e 2
5.5
e 2
C
C
A
5 mm
B
0.5
0.3
L
LPC2104/2105/2106
A
0.1
v
Single-chip 32-bit microcontrollers
A 1
y 1 C
0.05
w
PROJECTION
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
EUROPEAN
0.05
detail X
y
0.1
y 1
X
C
y
ISSUE DATE
01-08-08
02-10-18
SOT619-1
c
31 of 35
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