lpc2364 NXP Semiconductors, lpc2364 Datasheet - Page 46

• Manufacturer Part Number: lpc2364
• Description: Single-chip 16-bit/32-bit Microcontrollers; Up To 512 Kb Flash With Isp/iap, Ethernet, Usb 2.0, Can, And 10-bit Adc/dac
• Manufacturer: NXP Semiconductors

NXP Semiconductors
Fig 13. Package outline SOT926-1 (TFBGA100)
LPC2364_66_68_3
Product data sheet
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
SOT926-1
VERSION
OUTLINE
max
1.2
A
ball A1
index area
ball A1
index area
0.4
0.3
A
1
G
K
H
D
C
B
A
F
E
J
0.65
0.8
A
2
1
IEC
- - -
2
0.5
0.4
b
e
3
9.1
8.9
4
D
5
e
D
1
9.1
8.9
JEDEC
6
E
- - -
1/2 e
7
REFERENCES
0.8
e
8
Rev. 03 — 20 December 2007
b
9
0
7.2
e
10
1
JEITA
7.2
e
- - -
2
1/2 e
scale
B
2.5
e
w
v
0.15
v
M
M
e
A
E
2
C
C
0.05
A
w
5 mm
A
B
0.08
A
y
1
A
2
0.1
y
1
y
1
C
detail X
PROJECTION
LPC2364/66/68
EUROPEAN
Fast communication chip
X
C
y
© NXP B.V. 2007. All rights reserved.
ISSUE DATE
05-12-09
05-12-22
SOT926-1
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