mcimx50 Freescale Semiconductor, Inc, mcimx50 Datasheet

mcimx50

Manufacturer Part Number

mcimx50

Description

I.mx50 Applications Processors For Consumer Products

Manufacturer

Freescale Semiconductor, Inc

Datasheet

1.MCIMX50.pdf (120 pages)

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Freescale Semiconductor

Data Sheet: Advanced Information

i.MX50 Applications

Processors for

Consumer Products

The i.MX50 Applications Processors (i.MX50)

represent Freescale Semiconductor’s latest addition to a

growing family of multimedia-focused products,

offering high performance processing optimized for

lowest power consumption.

The i.MX50 is optimized for portable multimedia

applications and features Freescale’s advanced

implementation of the ARM Cortex-A8™ core, which

operates at speed as high as 800 MHz. The i.MX50

provides a powerful display architecture, including a 2D

Graphics Processing Unit (GPU) and Pixel Processing

Pipeline (ePXP). In addition, i.MX508 includes a

complete integration of the electrophoretic display

function. The i.MX50 supports DDR2, LPDDR2, and

LPDDR1 DRAM at clock rate up to 266 MHz to enable

a range of performance and power trade-offs.

The flexibility of the i.MX50 architecture allows it to be

used in a variety of applications. As the heart of the

application chipset, the i.MX50 provides a rich set of

interfaces for connecting peripherals, such as WLAN,

Bluetooth™, GPS, and displays.

Introduction

2. Architectural Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3. Modules List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . 19

5. Package Information and Contact Assignments . . . . . . 98

6. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 119

1.1. Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . 2

1.2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.3. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . 7

1.4. Part Number Feature Comparison . . . . . . . . . . . . . 7

1.5. Package Feature Comparison . . . . . . . . . . . . . . . . 8

2.1. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

3.1. Special Signal Considerations . . . . . . . . . . . . . . . 16

4.1. Chip-Level Conditions . . . . . . . . . . . . . . . . . . . . . 19

4.2. Supply Power-Up/Power-Down Requirements and

4.3. I/O DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 26

4.4. Output Buffer Impedance Characteristics . . . . . . 34

4.5. I/O AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . 37

4.6. System Modules Timing . . . . . . . . . . . . . . . . . . . . 45

4.7. External Interface Module (EIM) . . . . . . . . . . . . . . 57

4.8. DRAM Timing Parameters . . . . . . . . . . . . . . . . . . 66

4.9. External Peripheral Interfaces . . . . . . . . . . . . . . . 70

5.1. 416 MAPBGA 13 × 13 mm Package Information . 98

5.2. 400 MAPBGA 17x 17 mm 0.8 mm Pitch Package

5.3. Signal Assignments . . . . . . . . . . . . . . . . . . . . . . 109

Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

See

Case MAPBGA 13 x 13 mm, 0.5 mm pitch

Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103

Table 1 on page 7

Document Number: IMX50CEC

Package Information

Ordering Information

MCIMX50

Plastic Package

416 pin PBGA

for ordering information.

Rev. 0, 7/2011

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