tsl2561cs Pacer Components, tsl2561cs Datasheet - Page 34

• Manufacturer Part Number: tsl2561cs
• Description: Light-to-digital Converter
• Manufacturer: Pacer Components

TSL2560, TSL2561
LIGHT-TO-DIGITAL CONVERTER
TAOS059L − JANUARY 2008
34
Copyright E 2008, TAOS Inc.
The CS and T packages have been tested and have demonstrated an ability to be reflow soldered to a PCB
substrate. The process, equipment, and materials used in these test are detailed below.
The solder reflow profile describes the expected maximum heat exposure of components during the solder
reflow process of product on a PCB. Temperature is measured on top of component. The components should
be limited to a maximum of three passes through this solder reflow profile.
T
peak
T
T
T
3
2
1
Time (sec)
Average temperature gradient in preheating
Soak time
Time above 217°C
Time above 230°C
Time above T
Peak temperature in reflow
Temperature gradient in cooling
Figure 23. TSL2560/TSL2561 Solder Reflow Profile Graph
peak
PARAMETER
Table 13. TSL2560/61 Solder Reflow Profile
−10°C
MANUFACTURING INFORMATION
t
soak
r
www.taosinc.com
REFERENCE
T
t
soak
peak
t
t
t
1
2
3
260° C (−0°C/+5°C)
r
2 to 3 minutes
Max −5°C/sec
TSL2560/61
Max 60 sec
Max 50 sec
Max 10 sec
2.5°C/sec
t
t
t
3
2
1
Not to scale — for reference only
The LUMENOLOGY r Company