tsl2561cs Pacer Components, tsl2561cs Datasheet - Page 35

• Manufacturer Part Number: tsl2561cs
• Description: Light-to-digital Converter
• Manufacturer: Pacer Components

Tooling Required
Process
Additional Notes for Chipscale
Qualified Equipment
Qualified Materials
The LUMENOLOGY r Company
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1. Apply solder paste using stencil
2. Place component
3. Reflow solder/cure
4. X-Ray verify (recommended for chipscale only)
Placement of the TSL2560/TSL2561 chipscale device onto the gold immersion substrate is accomplished using
a standard surface mount manufacturing process. Using a 152-μm stencil with a 0.21 mm square aperture, print
solder paste onto the substrate. Machine-place the TSL2560/TSL2561 from the tape onto the substrate. A
suggest pick-up tool is the Siemens Vacuum Pickup tool nozzle number 912. This nozzle has a rubber tip with
a diameter of approximately 0.75 mm. The part is picked up from the center of the body.
It is important to use a substrate that has an immersion plating surface. This may be immersion gold, solder,
or white tin. Hot air solder leveled (HASL) substrates are not coplanar, making them difficult to work with.
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− Solder stencil (square aperture size 0.210 mm, stencil thickness of 152 μm)
− Solder stencil (aperture size 0.70 mm x 0.90 mm, stencil thickness of 152 μm)
− SIEMENS 912 — Vacuum Pickup Tool Nozzle
Chipscale
TMB
EKRA E5 — Stencil Printer
ASYMTEC Century — Dispensing system
SIEMENS F5 — Placement system
VITRONICS 820 — Oven
PHOENIX — Inspector X-Ray system
Microbond solder paste, part number NC421
MANUFACTURING INFORMATION
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www.taosinc.com
LIGHT-TO-DIGITAL CONVERTER
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TSL2560, TSL2561
TAOS059L − JANUARY 2008
Copyright E 2008, TAOS Inc.
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