ammc-6232 Avago Technologies, ammc-6232 Datasheet - Page 8

• Manufacturer Part Number: ammc-6232
• Description: 8 To 32 Ghz Gaas High Linearity Low Noise Amplifer
• Manufacturer: Avago Technologies

Assembly Techniques
The backside of the MMIC chip is RF ground. For microstrip
applications the chip should be attached directly to
the ground plane (e.g. circuit carrier or heatsink) using
electrically conductive epoxy
For best performance, the topside of the MMIC should be
brought up to the same height as the circuit surrounding
it. This can be accomplished by mounting a gold plated
metal shim (same length as the MMIC) under the chip
which is of correct thickness to make the chip and adjacent
circuit the same height. The amount of epoxy used for
the chip or shim attachment should be just enough to
provide a thin fillet around the bottom perimeter of the
chip. The ground plane should be free of any residue that
may jeopardize electrical or mechanical attachment.
RF connections should be kept as short as reasonable to
minimize performance degradation due to undesirable
series inductance. A single bond wire is normally sufficient
for signal connections, however double bonding with
0.7mil gold wire will reduce series inductance. Gold
thermo-sonic wedge bonding is the preferred method
for wire attachment to the bond pads. The recommended
wire bond stage temperature is 150°c ± 2°c.
Figure 22. Bond Pad Locations
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Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.
Data subject to change. Copyright © 200-2008 Avago Technologies Limited. All rights reserved. Obsoletes AV0-00EN
AV02-29EN - June 2, 2008
800
650
RFin
410
275
0
0
0
130
540
[1,2]
.
VG1
725
660
VD1
875
www.avagotech.com
Caution should be taken to not exceed the Absolute
Maximum Rating for assembly temperature and time.
The chip is 100um thick and should be handled with care.
This MMIC has exposed air bridges on the top surface and
should be handled by the edges or with a custom collet
(do not pick up the die with a vacuum on die center).
Bonding pads and chip backside metallization are gold.
This MMIC is also static sensitive and ESD precautions
should be taken
Notes:
1. Ablebond 84-1 LMI silver epoxy is recommended.
2. Eutectic attach is not recommended and may jeopardize reliability of
Ordering Information:
AMMC-6232-W10 = 10 devices per tray
AMMC-6232-W50 = 50 devices per tray
the device.
1370
1470
VD2
VG2
1510
1600
2000
RFout
425
290
0
800