le57d111 Zarlink Semiconductor, le57d111 Datasheet - Page 18

• Manufacturer Part Number: le57d111
• Description: Dual Subscriber Line Interface Circuit
• Manufacturer: Zarlink Semiconductor

44-Pin eTQFP
Note:
Packages may have mold tooling markings on the surface. These markings have no impact on the form, fit or function of the
device. Markings will vary with the mold tool used in manufacturing.
Notes:
1. Controlling dimension in millimeter unless otherwise specified.
2. Dimensions “D1” and “E1” do not include mold protrusion. Allowable protrusion is
3. Dimension “b” does not include Dambar protrusion. Allowable Dambar protrusion
4. Dambar can not be located on the lower radius or the foot. Minimum space between
5. Square dotted line is E-Pad outline.
6. “N” is the total number of terminals.
Symbol
0.25mm per side.
“D1” and “E1” are maximum plastic body size dimensions including mold mismatch.
shall not cause the lead width to exceed the maximum “b” dimension by more than 0.08mm.
protrusion and an adjacent lead is 0.07mm for 0.4mm and 0.5mm pitch packages.
D1
R2
R1
A1
A2
E1
D
A
E
1
2
3
11 deg
11 deg
0 deg
0 deg
0.08
0.08
0.05
0.95
Min
-
12 BSC
10 BSC
12 BSC
10 BSC
3.5 deg
12 deg
12 deg
Nom
1.00
-
-
-
-
-
Zarlink Semiconductor Inc.
44-Pin eTQFP
13 deg
13 deg
7 deg
Max
1.20
0.15
1.05
0.20
-
-
18
Symbol
aaa
bbb
ddd
ccc
D2
L1
E2
S
N
c
L
b
e
0.09
0.45
0.20
0.17
Min
0.80 BSC
1.00 REF
Nom
0.60
0.20
8.00
8.00
0.20
0.20
0.10
0.20
44
-
-
Max
0.20
0.75
0.27
-