trcv012g5 ETC-unknow, trcv012g5 Datasheet - Page 26

• Manufacturer Part Number: trcv012g5
• Description: Trcv012g5 Gbits/s Trcv012g7 Gbits/s Gbits/s Limiting Amplifier, Clock Recovery, Data Demultiplexer
• Manufacturer: ETC-unknow

TRCV012G5 and TRCV012G7
Limiting Amplifier, Clock Recovery, 1:16 Data Demultiplexer
Outline Diagram
Board Installation Recommendations
Thermal Considerations (MBIC 025 BiCMOS and MBIC 025 SiGe BiCMOS)
The TRCV012G5 and TRCV012G7 devices use a square heat sink on the bottom of the package for heat dissipa-
tion. This heat sink is planar with the lead surface which contacts the board. For optimum heat transfer, the heat
sink should be soldered to the application board using the suggested footprint shown above. Depending on the
application more heat sinking may be required.
Note: Certain precautions must be taken when using solder. For installation using a constant temperature solder,
Table 19. Thermal Resistance
26
Thermal resistance, junction to board
Thermal resistance, junction to
ambient
temperatures of under 300 °C may be employed for periods of time up to 5 seconds, maximum. For installa-
tion with a soldering iron (battery operated or non-switching only), the soldering tip temperature should not
be greater than 300 °C and the soldering time for each lead must not exceed 5 seconds.
Parameter
0.941
(continued)
0.311
0.100
0.193
Figure 12. Heat Sink Ground Pattern
0.050
0.320
0.100
Symbol
JB
JA
0.160
No air flow, device soldered to board
100 lfpm, device soldered to board
300 lfpm, device soldered to board
500 lfpm, device soldered to board
0.270
0.320
0.705
ø0.032
Conditions
0.050
0.160
0.060
0.270
0.019685
0.012
TYP
HEAT SINK
GROUND
PATTERN
Preliminary Data Sheet
Lucent Technologies Inc.
(°C/W)
Unit
15.6
14.6
11.5
18
August 2000
5-9862 (F)r.1