hi-3717 QuickLogic Corp, hi-3717 Datasheet - Page 21

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hi-3717

Manufacturer Part Number
hi-3717
Description
Single-rail Arinc 717 Protocol Ic With Spi Interface
Manufacturer
QuickLogic Corp
Datasheet
The HI-3717PCx uses a 44-pin plastic chip-scale package.
This package has a metal heat sink pad on its bottom
surface. This heat sink is electrically isolated from the die.
ORDERING INFORMATION
HEAT SINK - CHIP-SCALE PACKAGE ONLY
HI - 3717 xx x x
PART
NUMBER
PART
NUMBER
PART
NUMBER
Blank
PC
PQ
M
F
T
I
HOLT INTEGRATED CIRCUITS
LEAD
FINISH
Tin / Lead (Sn / Pb) Solder
100% Matte Tin (Pb-free, RoHS compliant)
TEMPERATURE
RANGE
PACKAGE
DESCRIPTION
44 PIN PLASTIC CHIP-SCALE, QFN (44PCS)
44 PIN PLASTIC QUAD FLAT PACK, PQFP (44PTQS)
-55°C TO +125°C
-55°C TO +125°C
-40°C TO +85°C
HI-3717
21
To enhance thermal dissipation, the heat sink can be
soldered to matching circuit board pad.
FLOW
M
T
I
BURN
Yes
No
IN
No

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