s71ns128pc0 Meet Spansion Inc., s71ns128pc0 Datasheet - Page 10

• Manufacturer Part Number: s71ns128pc0
• Description: Burst Mode Multiplexed Flash Memory And Burst Mode Multiplexed Psram
• Manufacturer: Meet Spansion Inc.

10
PACKAGE
SYMBOL
JEDEC
SE SD
D X E
Ø b
MD
ME
A1
A2
D1
E1
eE
eD
D
A
E
n
---
56
0.20
10
14
E13,E14,F1,F2,F13,F14,G1
MIN
0.85
0.25
H5,H6,H9,H10,H13,H14,
N/A
C2,C5,C6,C9,C10,C13,
D1,D2,D13,D14,E1,E2,
9.20 mm x 8.00 mm
,G2,G13,G14,H1,H2,
A2- A13,B1-B14,C1,
NSB
J1-J14, K2-K13
PACKAGE
9.20 BSC.
8.00 BSC.
4.50 BSC.
0.50 BSC.
0.50 BSC.
0.25 BSC.
6.50 BSC
NOM
0.30
C14,
---
---
---
056
S71NS-P Memory Subsystem Solutions
MAX
1.20
0.97
0.35
---
Figure 4.4 NSB056—56-ball VFBGA 9.2 x 8.0 mm
D a t a
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
NOTE
S h e e t
( P r e l i m i n a r y )
NOTES:
1.
2.
3.
4.
5.
8.
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
6
7
9
Y14.5M-1994.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.
FOR MATRIX SIZE MD X ME.
IN A PLANE PARALLEL TO DATUM C.
B AND DEFINE THE POSITION OF THE CENTER SOLDER BALL IN
THE OUTER ROW.
OUTER ROW SD OR SE = 0.000.
OUTER ROW, SD OR SE = e/2
BALLS.
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
DIMENSIONING AND TOLERANCING METHODS PER ASME
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION 4.3, SPP-010
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL DIAMETER
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A AND
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
“+” INDICATES THE THEORETICAL CENTER OF DEPOPULATED
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
e REPRESENTS THE SOLDER BALL GRID PITCH.
S71NS-P_00_05 December 13, 2007
NSB056 \ 16.038.22 \ 9.25.7