s71ns128pc0 Meet Spansion Inc., s71ns128pc0 Datasheet - Page 9

• Manufacturer Part Number: s71ns128pc0
• Description: Burst Mode Multiplexed Flash Memory And Burst Mode Multiplexed Psram
• Manufacturer: Meet Spansion Inc.

4.3
December 13, 2007 S71NS-P_00_05
Physical Dimensions
PACKAGE
SYMBOL
SD / SE
JEDEC
D x E
MD
ME
D1
Øb
eD
A A2
A1
A2
E1
eE
A
D
E
n
CORNER
0.10 C
(2X)
PIN A1
G1,G2,G13,G14,H1,H2,H5,H6,H9,H10,H13,H14
D1,D2,D13,D14,E1,E2,E13,E14,F1,F2,F13,F14
MIN
0.20
0.85
0.25
---
56X
D a t a
9.20 mm x 8.00 mm
C1,C2,C5,C6,C9,C10,C13,C14
0.15 M
0.08 M C
A1
A2 ~ A13,B1 ~ B14
J1 ~ J14, K2 ~ K13
PACKAGE
9.20 BSC.
8.00 BSC.
4.50 BSC.
6.50 BSC.
0.50 BSC.
0.25 BSC.
0.50 BSC
NLB 056
6
INDEX MARK
NOM
b
0.30
N/A
10
14
56
---
---
---
C
9
S h e e t
A
SIDE VIEW
B
TOP VIEW
MAX
1.20
0.97
0.35
S71NS-P Memory Subsystem Solutions
---
Figure 4.3 NLB056—56-ball VFBGA 9.2 x 8.0 mm
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
( P r e l i m i n a r y )
NOTE
C
0.10
A
(2X)
E
B
C
0.08
0.20
eE
C
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9
10. OUTLINE AND DIMENSIONS PER CUSTOMER REQUIREMENT.
14
13
12
11
10
9
8
7
6
5
4
3
2
1
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JEP95, SECTION 4.3,
SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
eD
SD
BOTTOM VIEW
K
7
J
H G
D1
F
E
D
C
B
A
SE
CORNER
PIN A1
3507\ 16-038.22 \ 7.14.5
7
E1
9