mt8htf12864az Micron Semiconductor Products, mt8htf12864az Datasheet

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mt8htf12864az

Manufacturer Part Number
mt8htf12864az
Description
1gb X64, Sr 240-pin Ddr2 Sdram Udimm
Manufacturer
Micron Semiconductor Products
Datasheet

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mt8htf12864az-667H1
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DDR2 SDRAM UDIMM
MT8HTF12864AZ – 1GB
For component data sheets, refer to Micron's Web site:
Features
• 240-pin, unbuffered dual in-line memory module
• Fast data transfer rates: PC2-8500, PC2-6400,
• 1GB (128 Meg x 64)
• V
• V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Single rank
• Multiple internal device banks for concurrent
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
• Programmable burst lengths (BL) 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Serial presence-detect (SPD) with EEPROM
• Gold edge contacts
• Halogen-free
Table 1:
PDF: 09005aef83b94f21/Source: 09005aef83b94f31
HTF8C128x64AZ.fm - Rev. A 8/09 EN
Speed
Grade
(UDIMM)
PC2-5300, PC2-4200, or PC2-3200
operation
-1GA
-80E
-800
-667
-53E
-40E
DD
DDSPD
= V
DDQ
= +1.7V to +3.6V
Key Timing Parameters
Products and specifications discussed herein are subject to change by Micron without notice.
Nomenclature
= +1.8V
Industry
PC2-8500
PC2-6400
PC2-6400
PC2-5300
PC2-4200
PC2-3200
CL = 7
1066
t
CK
CL = 6
800
800
Data Rate (MT/s)
www.micron.com
CL = 5
667
800
667
667
1
1GB (x64, SR) 240-Pin DDR2 SDRAM UDIMM
Figure 1:
Notes: 1. Contact Micron for industrial temperature
PCB height: 30.0mm (1.18in)
Options
• Operating temperature
• Package
• Frequency/CAS latency
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– 240-pin DIMM (halogen-free)
– 1.875ns @ CL = 7 (DDR2-1066)
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 5 (DDR2-667)
CL = 4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
533
533
533
533
400
2. Not recommended for new designs.
module offerings.
240-Pin UDIMM (MO-237 R/C D)
CL = 3
400
400
400
A
A
13.125
t
2
(ns)
12.5
≤ +85°C)
RCD
≤ +70°C)
15
15
15
15
©2003 Micron Technology, Inc. All rights reserved.
2
13.125
(ns)
12.5
t
15
15
15
15
RP
Marking
Features
None
-1GA
-80E
-800
-667
Z
I
(ns)
t
54
55
55
55
55
55
RC

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mt8htf12864az Summary of contents

Page 1

... DDR2 SDRAM UDIMM MT8HTF12864AZ – 1GB For component data sheets, refer to Micron's Web site: Features • 240-pin, unbuffered dual in-line memory module (UDIMM) • Fast data transfer rates: PC2-8500, PC2-6400, PC2-5300, PC2-4200, or PC2-3200 • 1GB (128 Meg x 64) • +1.8V DD DDQ • ...

Page 2

... Notes: 1. Data sheets for the base devices can be found on Micron’s Web site. 2. All part numbers end with a two-place code (not shown) that designates component and PCB revisions. Consult factory for current revision codes. Example: MT8HTF12864AZ-800H1. PDF: 09005aef83b94f21/Source: 09005aef83b94f31 HTF8C128x64AZ.fm - Rev. A 8/09 EN ...

Page 3

Pin Assignments and Descriptions Table 4: Pin Assignments 240-Pin UDIMM Front Pin Symbol Pin Symbol Pin Symbol Pin Symbol DQ19 61 REF DQ0 33 DQ24 63 4 DQ1 34 ...

Page 4

... SPD EEPROM power supply: +1.7V to +3.6V. DDSPD V Supply Reference voltage: V REF V Supply Ground – No connect: These pins are not connected on the module. PDF: 09005aef83b94f21/Source: 09005aef83b94f31 HTF8C128x64AZ.fm - Rev. A 8/09 EN 1GB (x64, SR) 240-Pin DDR2 SDRAM UDIMM C bus. / Pin Assignments and Descriptions Description 2 C bus. ...

Page 5

Functional Block Diagrams Figure 2: Functional Block Diagram, Type 1 S0# DQS0 DQS0 DM0 DQ0 DQ1 DQ2 DQ3 DQ4 DQ5 DQ6 DQ7 DQS1# DQS1 DM1 DQ8 DQ9 DQ10 DQ11 DQ12 DQ13 DQ14 DQ15 DQS2# DQS2 DM2 DQ16 DQ17 ...

Page 6

... General Description The MT8HTF12864AZ DDR2 SDRAM modules are high-speed, CMOS dynamic random access 1GB memory modules organized in a x64 configuration. These modules use 1Gb DDR2 SDRAM devices with eight internal banks. DDR2 SDRAM modules use double data rate architecture to achieve high-speed opera- tion ...

Page 7

... Electrical Specifications Stresses greater than those listed in Table 6 may cause permanent damage to the DRAM devices on the module. This is a stress rating only, and functional operation of the mod- ule at these or any other conditions outside those indicated in each device’s data sheet is not implied. Exposure to absolute maximum rating conditions for extended periods may adversely affect reliability ...

Page 8

... Micron encourages designers to simulate the signal characteristics of the system’s mem- ory bus to ensure adequate signal integrity of the entire memory system. Power Operating voltages are specified at the DRAM, not at the edge connector of the module. Designers must account for any system voltage drops at anticipated power levels to ensure the required supply voltage is maintained. ...

Page 9

I Specifications DD Table 8: DDR2 I Specifications and Conditions – 1GB DD Values are shown for the MT47H128M8 DDR2 SDRAM only and are computed from values specified in the 1Gb (128 Meg x 8) component data sheet Parameter/Condition Operating ...

Page 10

Serial Presence-Detect Table 9: Serial Presence-Detect EEPROM DC Operating Conditions Parameter/Condition Supply voltage Input high voltage: Logic 1; All inputs Input low voltage: Logic 0; All inputs Output low voltage 3mA OUT Input leakage current GND ...

Page 11

... TYP 1.0 (0.039) TYP (0.039) TYP 70.66 (2.782) TYP No components this side of module 197) TYP Pin 240 55.0 (2.165) TYP Notes: 1. All dimensions are in millimeters (inches); MAX/MIN or typical (TYP) where noted. 2. The dimensional diagram is for reference only. Refer to the JEDEC MO document for com- plete design dimensions ...

Page 12

Revision History Rev ...

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