hys64t32000hm-5-a Infineon Technologies Corporation, hys64t32000hm-5-a Datasheet - Page 20

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hys64t32000hm-5-a

Manufacturer Part Number
hys64t32000hm-5-a
Description
240-pin Registered Ddr2 Sdram Modules
Manufacturer
Infineon Technologies Corporation
Datasheet
Table 11
Parameter
Device Supply Voltage
Output Supply Voltage
Input Reference Voltage
SPD Supply Voltage
DC Input Logic High
DC Input Logic Low
In / Output Leakage Current
1) Under all conditions,
2) Peak to peak AC noise on
3) Input voltage for any connector pin under test of 0 V
3.3
3.3.1
Table 12
Speed Grade
IFX Sort Name
CAS-RCD-RP latencies
Parameter
Clock Frequency
Row Active Time
Row Cycle Time
RAS-CAS-Delay
Row Precharge Time
1) Timings are guaranteed with CK/CK differential Slew Rate of 2.0 V/ns. For DQS signals timings are guaranteed with a
2) The CK/CK input reference level (for timing reference to CK/CK) is the point at which CK and CK cross. The DQS/DQS,
3) Inputs are not recognized as valid until
4) The output timing reference voltage level is
5)
Data Sheet
differential Slew Rate of 2.0 V/ns in differential strobe mode and a Slew Rate of 1 V/ns in single ended mode. Timings are
further guaranteed for normal OCD drive strength (EMRS(1) A1 = 0) only.
RDQS/RDQS, input reference level is the crosspoint when in differential strobe mode
recognized as low.
t
equal to 9 x
RAS.MAX
is calculated from the maximum amount of time a DDR2 device can operate without a refresh command which is
Supply Voltage Levels and DC Operating Conditions
AC Characteristics
Speed Grade Definitions
Speed Grade Definition Speed Bins for DDR2-667D, DDR2–533C and DDR2–400B
t
REFI
.
@ CL = 3
@ CL = 4
@ CL = 5
V
DDQ
must be less than or equal to
V
REF
Symbol
V
V
V
V
V
V
I
may not exceed ± 2%
t
t
t
t
t
t
t
L
Symbol
CK
CK
CK
RAS
RC
RCD
RP
DD
DDQ
REF
DDSPD
IH (DC)
IL (DC)
V
REF
V
DDR2–667D
–3S
5–5–5
Min.
5
3.75
3
45
60
15
15
TT
stabilizes. During the period before
Values
Min.
1.7
1.7
0.49 x
1.7
V
– 0.30
– 5
.
REF
+ 0.125
8
8
8
70000
V
V
V
IN
REF (DC)
DDQ
V
20
DD
V
DDQ
.
V
DDR2–533C
–3.7
4–4–4
Min.
5
3.75
3.75
45
60
15
15
Nom.
1.8
1.8
0.5 x
REF
+ 0.3 V; all other pins at 0 V. Current is per pin
HYS64T[32/64]0[0/2]0HM–[3S/3.7/5]–A
is also expected to track noise in
Micro-DIMM DDR2 SDRAM Modules
V
DDQ
Max.
8
8
8
70000
Max.
1.9
1.9
0.51 x
3.6
V
V
5
V
DDQ
REF
DDR2–400B
–5
3–3–3
Min.
5
5
5
40
55
15
15
REF
– 0.125
+ 0.3
stabilizes, CKE = 0.2 x
V
Electrical Characteristics
DDQ
Max.
8
8
8
70000
03242004-2CBE-IJ2X
Unit
V
V
V
V
V
V
Rev. 1.1, 2005-10
V
A
DDQ
Unit
t
ns
ns
ns
ns
ns
ns
ns
CK
.
Note
1)
2)
3)
Notes
1)2)3)4)
5)
V
DDQ
is

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