tga2522-sm TriQuint Semiconductor, tga2522-sm Datasheet - Page 17

• Manufacturer Part Number: tga2522-sm
• Description: 17 - 24 Ghz Power Amplifier
• Manufacturer: TriQuint Semiconductor

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should
be observed during handling, assembly and test.
Time within 5 °C of Peak Temperature
Recommended Surface Mount Package Assembly
Activation Time and Temperature
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Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow
oven vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles
are listed in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot
placement. The volume of solder paste depends on PCB and component layout and should be well
controlled to ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Time above Melting Point
Max Peak Temperature
Reflow Profile
Ramp-down Rate
Ramp-up Rate
TGA2522-SM, TAPE AND REEL
TriQuint Semiconductor: www. triquint.com [phone] Fax [phone] [e-mail]
Part
Ordering Information
Assembly Notes
60 – 120 sec @ 140 – 160 °C
Apr 2008 © Rev -
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
3 °C/sec
SnPb
240 °C
4 x 4 mm QFN Surface Mount, TAPE AND REEL
Package Style
60 – 180 sec @ 150 – 200 °C
TGA2522-SM
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
Pb Free
3 °C/sec
260 °C
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