tga2925-sg TriQuint Semiconductor, tga2925-sg Datasheet - Page 10

• Manufacturer Part Number: tga2925-sg
• Description: 5.6 Watt 3.5 Ghz Packaged Hpa
• Manufacturer: TriQuint Semiconductor

TriQuint Semiconductor Texas Phone: [phone] Fax: [phone] Email: [e-mail] Web: www.triquint.com
Proper ESD precautions must be followed while handling packages.
Clean the board with acetone. Rinse with alcohol. Allow the circuit to fully dry.
TriQuint recommends using a conductive solder paste for attachment. Follow solder paste and reflow oven
vendors’ recommendations when developing a solder reflow profile. Typical solder reflow profiles are listed
in the table below.
Hand soldering is not recommended. Solder paste can be applied using a stencil printer or dot placement.
The volume of solder paste depends on PCB and component layout and should be well controlled to
ensure consistent mechanical and electrical performance.
Clean the assembly with alcohol.
Time above Melting Point
Time within 5 °C of Peak
Max Peak Temperature
Activation Time and
Reflow Profile
Ramp-down Rate
Ramp-up Rate
Temperature
Temperature
Recommended Surface Mount Package Assembly
TGA2925-SG
Part
Typical Solder Reflow Profiles
60 – 120 sec @ 140 – 160 °C
Ordering Information
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
3 °C/sec
SnPb
240 °C
Advance Product Information
Gull Wing Leads
Package Style
60 – 180 sec @ 150 – 200 °C
60 – 150 sec
4 – 6 °C/sec
10 – 20 sec
Pb Free
February 15, 2008
3 °C/sec
260 °C
TGA2925-SG
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