tga8310 TriQuint Semiconductor, tga8310 Datasheet - Page 11

• Manufacturer Part Number: tga8310
• Description: Low-noise Amplifier
• Manufacturer: TriQuint Semiconductor

MECHANICAL DRAWING
TriQuint Semiconductor, Inc.
(0.0930)
(0.0371)
(0.0286)
(0.0487)
(0.0704)
2,3622
0,9423
0,7264
1,2370
1,7882
•
Texas Facilities
0
0
(0.0060)
0,1524
(0.0055)
2
1
3
0,1397
Units: millimeters (inches)
Thickness: 0,1016 (0.004) (r eference only)
Chip edge to bond pad dimensions are shown to center of bond pad.
Chip size ±0,0508 (0.002)
Bond pad #1 (RF Input):
Bond pad #2 (RF Input):
Bond pad #3 (V
Bond pad #4 (V
Bond pad #5 (V
Bond pad #6 (RF Output):
Bond pad #7 (RF Output):
Bond pad #8 (V
(0.0234)
0,5944
4
• [phone]
CTRL
D
G1
+
):
):
):
):
(0.0676)
1,7170
5
• www.triquint.com
0,1016 x 0,1524 (0.0040 x 0.0060)
0,1321 x 0,2108 (0.0052 x 0.0083)
0,2032 x 0,1016 (0.0080 x 0.0040)
0,0940 x 0,0991 (0.0037 x 0.0039)
0,0940 x 0,0991 (0.0037 x 0.0039)
0,0940 x 0,0991 (0.0037 x 0.0039)
0,0940 x 0,0991 (0.0037 x 0.0039)
0,0965 x 0,0965 (0.0038 x 0.0038)
(0.0951)
2,4155
8
TGA8310-SCC
(0.1564)
3,9746
6
7
(0.1620)
4,1148
(0.0359)
(0.0766)
(0.0274)
(0.0099)
1,9456
0,9119
0,6960
0,2515
11