hmc554 Hittite Microwave Corporation, hmc554 Datasheet
hmc554
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hmc554 Summary of contents
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... GHz. The miniature monolithic mixer is fabricated in a GaAs MESFET process, and requires no external components or matching circu- itry. The HMC554 provides excellent and isolation due to optimized balun structures. Measurements were made with the chip mounted into ohm test fi xture and includes the para- sitic effects of wire bond assembly. Connections were made with a 1 mil wire bond with minimal length (< ...
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... Return Loss @ LO = +13 dBm 0 -5 -10 -15 - Upconverter Performance Conversion Gain vs. LO Drive 0 -5 -10 -15 - Order On-line at www.hittite.com HMC554 MIXER GHz RF/IF LO/RF LO/ FREQUENCY (GHz FREQUENCY (GHz) +9 dBm +11 dBm ...
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... MxN Spurious Outputs mRF +25C +85C -40C RF = 15.1 GHz @ -10 dBm LO = 15.0 GHz @ +13 dBm All values in dBc below the IF output power level Order On-line at www.hittite.com HMC554 GaAs MMIC FUNDAMENTAL MIXER GHz +25 C + ...
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... BACKSIDE METAL IS GROUND. 8. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 9. THIS DIE IS DESIGNED FOR PICK-UP WITH VACUUM (EDGE) COLLET TOOLS. TO PRECLUDE THE RISK OF PERMANENT DAMAGE, NO CONTACT TO THE DIE SURFACE IS ALLOWED WITHIN THIS RECTANGULAR AREA. Order On-line at www.hittite.com HMC554 MIXER GHz ...
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... IF frequency range. For operation to DC, this pin must not source or sink more than current or part non-function and possible part failure will result. The backside of the die must be connected to RF ground. Order On-line at www.hittite.com HMC554 MIXER GHz Interface Schematic ...
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... Thick GaAs MMIC 0.076mm (0.003”) 0.150mm (0.005”) Thick Moly Tab Order On-line at www.hittite.com HMC554 MIXER GHz 3 mil Ribbon Bond RF Ground Plane 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. 3 mil Ribbon Bond RF Ground Plane 0.254mm (0.010” ...