hmc554 Hittite Microwave Corporation, hmc554 Datasheet - Page 4

• Manufacturer Part Number: hmc554
• Description: Gaas Mmic Fundamental Mixer, 11 - 20 Ghz
• Manufacturer: Hittite Microwave Corporation

Absolute Maximum Ratings
Outline Drawing
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
RF / IF Input
LO Drive
Channel Temperature
Continuous Pdiss (T = 85 °C)
(derate 3.26 mW/°C above 85 °C)
Thermal Resistance
(channel to die bottom)
Storage Temperature
Operating Temperature
ESD Sensitivity (HBM)
Standard
WP-7
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
+25 dBm
+25 dBm
150 °C
212 mW
306 °C/W
-65 to +150 °C
-55 to +85 °C
Class 1C
Alternate
v02.1007
[2]
Order On-line at www.hittite.com
[1]
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS .004”.
3. TYPICAL BOND PAD IS .004” SQUARE.
4. BOND PAD SPACING CENTER TO CENTER IS .006”.
5. BACKSIDE METALLIZATION: GOLD.
6. BOND PAD METALLIZATION: GOLD.
7. BACKSIDE METAL IS GROUND.
8. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
9. THIS DIE IS DESIGNED FOR PICK-UP WITH VACUUM (EDGE)
COLLET TOOLS. TO PRECLUDE THE RISK OF PERMANENT
DAMAGE, NO CONTACT TO THE DIE SURFACE IS ALLOWED
WITHIN THIS RECTANGULAR AREA.
GaAs MMIC FUNDAMENTAL
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
MIXER, 11 - 20 GHz
HMC554
4 - 69
4