hmc560 Hittite Microwave Corporation, hmc560 Datasheet
hmc560
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hmc560 Summary of contents
Page 1
... High LO/RF Isolation Passive Double Balanced Topology Compact Size: 1.14 x 0.59 x 0.1 mm General Description The HMC560 chip is a miniature passive double bal- anced mixer which is fabricated in a GaAs MESFET process, and can be used as an upconverter or down- converter from 24-40 GHz in a small chip area. The wide bandwidth allows this device to be used across multiple radio bands with a common platform ...
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... IF Bandwidth @ LO = +13 dBm 0 -5 -10 -15 - Return Loss @ LO = +13 dBm 0 -5 -10 -15 -20 - Order On-line at www.hittite.com HMC560 MIXER GHz LO/RF RF/IF LO/ FREQUENCY (GHz) Conversion Gain IF Return Loss FREQUENCY (GHz ...
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... Input P1dB vs. Temperature @ LO = +13 dBm Order On-line at www.hittite.com HMC560 MIXER GHz + + FREQUENCY (GHz) +25 C + ...
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... BACKSIDE METAL IS GROUND. 7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS. 8. THIS DIE IS DESIGNED FOR PICK-UP WITH VACUUM (EDGE) COLLET TOOLS. TO PRECLUDE THE RISK OF PERMANENT DAMAGE, NO CONTACT TO THE DIE SURFACE IS ALLOWED WITHIN THIS RECTANGULAR AREA. Order On-line at www.hittite.com HMC560 MIXER GHz nLO ...
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... IF frequency range. For operation to DC, this pad must not source/sink more than 2mA of cur- rent or die non-function and possible die failure will result. The backside of the die must be connected to RF/DC ground. Order On-line at www.hittite.com HMC560 MIXER GHz Interface Schematic ...
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... Thick GaAs MMIC 0.076mm (0.003”) 0.150mm (0.005”) Thick Moly Tab Order On-line at www.hittite.com HMC560 MIXER GHz 3 mil Ribbon Bond RF Ground Plane 0.127mm (0.005”) Thick Alumina Thin Film Substrate Figure 1. 3 mil Ribbon Bond RF Ground Plane 0.254mm (0.010” ...