hmc560 Hittite Microwave Corporation, hmc560 Datasheet - Page 4

• Manufacturer Part Number: hmc560
• Description: Gaas Mmic Fundamental Mixer, 24 - 40 Ghz
• Manufacturer: Hittite Microwave Corporation

Absolute Maximum Ratings
Outline Drawing
Die Packaging Information
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] For alternate packaging information contact Hittite
Microwave Corporation.
RF / IF Input
LO Drive
IF DC Current
Channel Temperature
Continuous Pdiss (T= 85 °C )
(derate 14.79 mW/ °C above 85 °C)
Thermal Resistance (R
(channel to die bottom)
Storage Temperature
Operating Temperature
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Standard
WP-7
For price, delivery, and to place orders, please contact Hittite Microwave Corporation:
20 Alpha Road, Chelmsford, MA 01824 Phone: [phone] Fax: [phone]
TH
)
+25 dBm
+23 dBm
±2 mA
150 °C/W
0.961 W
67.6 °C/W
-65 to +150 °C
-55 to +85 °C
Alternate
v00.0705
[1]
[2]
Order On-line at www.hittite.com
GaAs MMIC DOUBLE-BALANCED
MxN Spurious Outputs
as a Down Converter
NOTES:
1. ALL DIMENSIONS ARE IN INCHES [MM].
2. DIE THICKNESS IS .004”.
3. TYPICAL BOND PAD IS .004” SQUARE.
4. BACKSIDE METALLIZATION: GOLD.
5. BOND PAD METALLIZATION: GOLD.
6. BACKSIDE METAL IS GROUND.
7. CONNECTION NOT REQUIRED FOR UNLABELED BOND PADS.
8. THIS DIE IS DESIGNED FOR PICK-UP WITH VACUUM (EDGE)
RF = 24 GHz @ -10 dBm
LO = 25 GHz @ +13 dBm
All values in dBc below IF output power level.
COLLET TOOLS. TO PRECLUDE THE RISK OF PERMANENT
DAMAGE, NO CONTACT TO THE DIE SURFACE IS ALLOWED
WITHIN THIS RECTANGULAR AREA.
mRF
0
1
2
3
4
58
xx
0
3
48
78
-5
1
0
MIXER, 24 - 40 GHz
nLO
25
49
73
88
2
5
HMC560
58
63
85
3
83
89
4
4 - 87
4