k7a803601m Samsung Semiconductor, Inc., k7a803601m Datasheet

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k7a803601m

Manufacturer Part Number
k7a803601m
Description
256kx36 & 512kx18 Synchronous Sram
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
K7A803601M
K7A801801M
Document Title
Revision History
specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions on the parameters of this device. If you have any ques-
tions, please contact the SAMSUNG branch office near your office, call or contact Headquarters.
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right to change the
256Kx36 & 512Kx18-Bit Synchronous Pipelined Burst SRAM
Rev. No.
0.0
0.1
0.2
0.3
0.4
0.5
0.6
1.0
2.0
3.0
History
Initial draft
Modify DC characteristics( Input Leakage Current test Conditions)
form V
Remove 119BGA Package Type.
Change DC Characteristics.
I
I
I
I
I
1. Changed t
2. Changed DC condition at Icc and parameters
A
Changed V
Final spec Release.
1. Remove V
1. Add V
SB
SB
SB
SB1
SB2
DD
Icc ; from 375mA to 400mA at -72,
I
Changed t
SB
value from 65mA to 110mA at -72
value from 60mA to 110mA at -85
value from 50mA to 100mA at -10
value from 10mA to 30mA
value from 10mA to 30mA
V
DD
; from 110mA to 130mA at -72,
DDQ
from 340mA to 380mA at -85,
from 300mA to 350mA at -10,
from 110mA to 130mA at -85,
from 100mA to 120mA at -10
=V
DDQ
Supply voltage( 2.5V )
OL
SS
CD
OE
DDQ
Supply voltage( 2.5V I/O )
Max value from 0.2V to 0.4V at 2.5V I/O.
to V
from 4.0ns to 4.2ns at -85.
from 4.0ns to 4.2ns at -85.
Supply voltage( 2.5V I/O )
DD
to Max.
256Kx36 & 512Kx18 Synchronous SRAM
- 1 -
Draft Date
May. 07 . 1998
June .08. 1998
Aug. 20. 1998
Aug. 27. 1998
Sep. 09. 1998
Dec. 10. 1998
Dec. 23. 1998
Jan. 29. 1999
Feb. 25. 1999
May. 13. 1999
Remark
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Final
Final
Final
May 1999
Rev 3.0

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k7a803601m Summary of contents

Page 1

... K7A803601M K7A801801M Document Title 256Kx36 & 512Kx18-Bit Synchronous Pipelined Burst SRAM Revision History Rev. No. History 0.0 Initial draft 0.1 Modify DC characteristics( Input Leakage Current test Conditions) form Max 0.2 Remove 119BGA Package Type. 0.3 Change DC Characteristics. I value from 65mA to 110mA at - value from 60mA to 110mA at -85 ...

Page 2

... LBO pin is DC operated and determines burst sequence(linear or interleaved). ZZ pin controls Power Down State and reduces Stand-by cur- rent regardless of CLK. -10 Unit The K7A803601M and K7A801801M are fabricated using SAM- SUNG s high performance CMOS technology and is available 100pin TQFP package. Multiple power and ground pins are 4 ...

Page 3

... The pin 42 is reserved for address bit for the 16Mb . 256Kx36 & 512Kx18 Synchronous SRAM 100 Pin TQFP (20mm x 14mm) K7A803601M(256Kx36) TQFP PIN NO. SYMBOL PIN NAME 32,33,34,35,36,37,43 V Power Supply(+3.3V) ...

Page 4

... K7A803601M K7A801801M PIN CONFIGURATION (TOP VIEW) N.C. 1 N. DDQ V 5 SSQ 6 N.C. 7 N.C. DQb 8 0 DQb SSQ V 11 DDQ DQb 12 2 DQb DQb 18 4 DQb DDQ V 21 SSQ DQb 22 6 DQb 23 7 DQPb 24 N ...

Page 5

... K7A801801M FUNCTION DESCRIPTION The K7A803601M and K7A801801M are synchronous SRAM designed to support the burst address accessing sequence of the Power PC based microprocessor. All inputs (with the exception of OE, LBO and ZZ) are sampled on rising clock edges. The start and duration of the burst access is controlled by ADSC, ADSP and ADV and chip select pins. ...

Page 6

... K7A803601M K7A801801M TRUTH TABLES SYNCHRONOUS TRUTH TABLE ADSP ADSC ADV ...

Page 7

... K7A803601M K7A801801M PASS-THROUGH TRUTH TABLE PREVIOUS CYCLE OPERATION WRITE Write Cycle, All bytes All L Address=An-1, Data=Dn-1 Write Cycle, All bytes All L Address=An-1, Data=Dn-1 Write Cycle, All bytes All L Address=An-1, Data=Dn-1 Write Cycle, One byte One L Address=An-1, Data=Dn-1 Write Cycle, One byte ...

Page 8

... K7A803601M K7A801801M DC ELECTRICAL CHARACTERISTICS PARAMETER SYMBOL Input Leakage Current(except ZZ Output Leakage Current I OL Operating Current Standby Current I SB1 I SB2 Output Low Voltage(3.3V I/ Output High Voltage(3.3V I/ Output Low Voltage(2.5V I/ Output High Voltage(2.5V I/ Input Low Voltage(3.3V I/O) ...

Page 9

... K7A803601M K7A801801M Output Load(A) Dout Zo=50 AC TIMING CHARACTERISTICS PARAMETER Cycle Time Clock Access Time Output Enable to Data Valid Clock High to Output Low-Z Output Hold from Clock High Output Enable Low to Output Low-Z Output Enable High to Output High-Z Clock High to Output High-Z Clock High Pulse Width ...

Page 10

... K7A803601M K7A801801M 256Kx36 & 512Kx18 Synchronous SRAM - 10 - May 1999 Rev 3.0 ...

Page 11

... K7A803601M K7A801801M 256Kx36 & 512Kx18 Synchronous SRAM - 11 - May 1999 Rev 3.0 ...

Page 12

... K7A803601M K7A801801M 256Kx36 & 512Kx18 Synchronous SRAM - 12 - May 1999 Rev 3.0 ...

Page 13

... K7A803601M K7A801801M 256Kx36 & 512Kx18 Synchronous SRAM - 13 - May 1999 Rev 3.0 ...

Page 14

... K7A803601M K7A801801M 256Kx36 & 512Kx18 Synchronous SRAM - 14 - May 1999 Rev 3.0 ...

Page 15

... K7A803601M K7A801801M APPLICATION INFORMATION DEPTH EXPANSION The Samsung 256Kx36 Synchronous Pipelined Burst SRAM has two additional chip selects for simple depth expansion. This permits easy secondary cache upgrades from 256K depth to 512K depth without extra logic. Data Address A [0:18] CLK Microprocessor CLK ...

Page 16

... K7A803601M K7A801801M APPLICATION INFORMATION DEPTH EXPANSION The Samsung 512Kx18 Synchronous Pipelined Burst SRAM has two additional chip selects for simple depth expansion. This permits easy secondary cache upgrades from 512K depth to 1M depth without extra logic. Data Address A [0:19] CLK Microprocessor CLK ...

Page 17

... K7A803601M K7A801801M PACKAGE DIMENSIONS 100-TQFP-1420A 22.00 20.00 #1 0.65 256Kx36 & 512Kx18 Synchronous SRAM 0.30 0.20 16.00 0.30 14.00 0.20 (0.83) (0.58) 0.30 0.10 0.10 MAX 1.40 1.60 MAX 0.10 0.05 MIN 0.50 0. Units ; millimeters/Inches 0~8 + 0.10 0.127 - 0.05 0.10 MAX 0.50 0.10 May 1999 Rev 3.0 ...

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