2016L150 LITTELFUSE [Littelfuse], 2016L150 Datasheet - Page 26

• Manufacturer Part Number: 2016L150
• Manufacturer: LITTELFUSE [Littelfuse]

• R ecommendedreflowmethods:IR,vaporphaseoven,hotair
• D evicesarenotdesignedtobewavesolderedtothebottomside
• R ecommendedmaximumpastethicknessis0.25mm(0.010inch)
• D evicescanbecleanedusingstandardindustrymethodsand
Note: I freflowtemperaturesexceedtherecommendedprofile,
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Soldering Parameters
Condition
Peak Temp/ Duration Time
Time above liquids (TAL) 220°C
Preheat 120°C~ 180°C
Storage Condition
oven,N
oftheboard.
solvents.
Physical Specifications
Terminal Material
Lead Solderability
devicesmaynotmeettheperformancerequirements.
2
environmentforlead-free
Solder-PlatedCopper(SolderMaterial:
MatteTin(Sn))
MeetsEIASpecificationRS186-9E,ANSI/
J-STD-002Category3.
Reflow
260°C/10Sec
60Sec~100Sec
50Sec~150Sec
0°C~35°C, < = 70%RH
POLYFUSE
Surface Mount
Electronics Designers Guide
®
Resettable PTCs

Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Vibration
Environmental Specifications
260
220
180
120
0
Preheating
50 to 150
Soldering
60 to 100
Time(s)
Specifications are subject to change without notice.
-40°Cto+85°C
125°C
+85°C,1000hours
±5%typicalresistancechange
+85°C,85%R.H.1000hours
±5%typicalresistancechange
MIL-STD-202Method107G
+85°C/-40°C20times
-30%typicalresistancechange
MIL-STD-202,Method215
MIL-STD-883C,Method
2007.1,ConditionA
120
Cooling
0L Series