2016L150 LITTELFUSE [Littelfuse], 2016L150 Datasheet - Page 72

• Manufacturer Part Number: 2016L150
• Manufacturer: LITTELFUSE [Littelfuse]

www.littelfuse.com
©2006 Littelfuse
Soldering Parameters - Wave Soldering
Pre-Heating Zone
Soldering Zone
Cooling Zone
Physical Specifications
Lead Material
Soldering
Characteristics
Insulating Material
Device Labeling
.90-2.50A:Tin-platedcoppercladsteel
.75A:Tin-platedcopper
SolderabilityperMIL-STD-202,
Method208E
Cured,flameretardantepoxypolymer
meetsUL94V-0requirements.
MarkedwithLF,voltage,currentrating,
anddatecode.
Refertothecondition
recommendedbythe
fluxmanufacturer.
Max.rampingrate
shouldnotexceed
4°C/Sec.
Max.soldertemperature
shouldnotexceed
260°C
Coolingbynatural
convectioninair.
POLYFUSE
Radial Leaded
Electronics Designers Guide
®
Resettable PTCs

Operating/Storage
Temperature
Maximum Device Surface
Temperature in Tripped State
Passive Aging
Humidity Aging
Thermal Shock
Solvent Resistance
Environmental Specifications
260
220
190
160
0
Preheating
60 min.
Soldering
5 max.
Time(s)
Specifications are subject to change without notice.
-40°Cto+85°C
125°C
+85°C,1000hours
±5%typicalresistancechange
+85°C,85%R.H.1000hours
±5%typicalresistancechange
+85°Cto-40°C10times
±5%typicalresistancechange
MIL-STD-202,Method215F
Cooling
USBR Series