2016L150 LITTELFUSE [Littelfuse], 2016L150 Datasheet - Page 57

• Manufacturer Part Number: 2016L150
• Manufacturer: LITTELFUSE [Littelfuse]

*Resistancebinnedpartsarerecommended
• R ecommendedsolderingmethods:heatelementovenor
• D evicesaredesignedtobewavesolderedtothebottom
• D evicescanbecleanedusingstandardindustrymethods
• T hisprofilecanbeusedforlead-freedevice
Note: I fsolderingtemperaturesexceedtherecommended
00R Series
Specifications are subject to change without notice.
Region/Specification
NorthAmerica
TelcordiaGR-1089
NorthAmerica
TIA-968-A,UL60950
NorthAmerica
TelcordiaGR-1089
NorthAmerica
TelcordiaGR-1089
SouthAmerica/Asia/Europe
ITUK.20andK.21
Protection Application Guide
Soldering Parameters - Wave Soldering
Condition
Peak Temp/ Duration Time
> 220°C
Preheat 140°C~ 180°C
Storage Condition
N
sideoftheboard.
andsolvents.
2
environmentforlead-free
profile,devicesmaynotmeettheperformance
requirements.
*Intrabuildingcommunicationsystems
*Accessnetworkequipment
CustomerandITequipment
Phonesets,PBXsystems
ADSL,XDSLmodems
POTS/ISDNlinecards
ADSL/VDSLsplitters
Localloophandsets
WaveSoldering
260°C < 5Sec
2Sec~20Sec
180Sec~210Sec
0°C~35°C, < 70%RH
Internetappliances
T1/E1/J1linecards
WANequipment
LAN,VOIPcards
Analogmodems
Remoteterminal
Cross-connect
POSterminals
POLYFUSE
Radial Leaded
CentralOffice
Application
Repeaters
CSU/DSU
Electronics Designers Guide
®
Resettable PTCs
58
260
220
190
160
0
Device Selection
600R150
600R160
600R150
600R160
600R150
600R160
600R150
600R160
180 to 210
Preheating
Soldering
2 to 5
Time(s)
20-30
Cooling
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