ADF4110 Analog Devices, ADF4110 Datasheet - Page 4

• Manufacturer Part Number: ADF4110
• Description: Single, Integer-N, 550 MHZ PLL With Programmable Prescaler And Charge Pump
• Manufacturer: Analog Devices

ADF4110/ADF4111/ADF4112/ADF4113
ABSOLUTE MAXIMUM RATINGS
(T
AV
AV
V
V
Digital I/O Voltage to GND . . . . . . . . –0.3 V to V
Analog I/O Voltage to GND . . . . . . . . . –0.3 V to V
REF
RF
Operating Temperature Range
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150°C
TSSOP θ
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumu-
late on the human body and test equipment and can discharge without detection. Although the
ADF4110/ADF4111/ADF4112/ADF4113 features proprietary ESD protection circuitry, permanent
damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD
precautions are recommended to avoid performance degradation or loss of functionality.
Model
ADF4110BRU
ADF4110BCP
ADF4111BRU
ADF4111BCP
ADF4112BRU
ADF4112BCP
ADF4113BRU
ADF4113BCP
ADF4113BCHIPS
Contact the factory for chip availability.
P
P
A
Industrial (B Version) . . . . . . . . . . . . . . . –40°C to +85°C
IN
DD
DD
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
to AV
= 25°C unless otherwise noted)
IN
A to RF
to GND
to DV
, RF
DD
JA
IN
Thermal Impedance . . . . . . . . . . . . . 150.4°C/W
DD
A, RF
IN
CLOCK
. . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
DATA
3
B . . . . . . . . . . . . . . . . . . . . . . . . . . . ± 320 mV
LE
LE
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
. . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
IN
B to GND . . . . . . –0.3 V to V
DB20 (MSB)
Temperature Range
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
–40°C to +85°C
1, 2
t
1
DB19
t
2
DD
DD
P
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
+ 0.3 V
Package Description
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package (CSP)
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package (CSP)
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package (CSP)
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package (CSP)
DICE
DB2
t
3
CSP θ
CSP θ
Lead Temperature, Soldering
NOTES
1
2
3
TRANSISTOR COUNT
6425 (CMOS) and 303 (Bipolar).
Stresses above those listed under Absolute Maximum Ratings may cause perma-
This device is a high-performance RF integrated circuit with an ESD rating of
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
< 2 kV and it is ESD sensitive. Proper precautions should be taken for handling
and assembly.
GND = AGND = DGND = 0 V.
(Paddle Not Soldered) . . . . . . . . . . . . . . . . . . . . . 216°C/W
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
t
4
(CONTROL BIT C2)
JA
JA
Thermal Impedance (Paddle Soldered) . . . 122°C/W
Thermal Impedance
DB1
(CONTROL BIT C1)
DB0 (LSB)
WARNING!
t
5
t
6
Package Option
RU-16
CP-20
RU-16
CP-20
RU-16
CP-20
RU-16
CP-20
DICE
ESD SENSITIVE DEVICE