S10201-04 HAMAMATSU [Hamamatsu Corporation], S10201-04 Datasheet

S10201-04

Manufacturer Part Number

S10201-04

Description

Back-thinned TDI-CCD Operating the back-thinned CCD in TDI mode delivers high sensitivity.

Manufacturer

HAMAMATSU [Hamamatsu Corporation]

Datasheet

1.S10201-04.pdf (11 pages)

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PRELIMINARY DATA

I M A G E S E N S O R

Back-thinned TDI-CCD

S10200-02, S10201-04, S10202-08, S10202-16

TDI-CCD captures clear and bright images even under low-light-level conditions. During TDI mode, the CCD captures an image of a moving

object while transferring integrated signal charges synchronously with the object movement. This operation mode dramatically boosts sensitivity

to high levels even when capturing fast moving objects. Our new TDI-CCD uses the back-thinned structure to achieve even higher quantum

efficiency over a wide spectral range from UV to near IR region (200 to 1100 nm).

In FFT-CCD, signal charges in each line are vertically transferred during charge readout. TDI mode synchronizes this vertical

transfer timing with the movement of the object, so that signal charges are integrated a number of times equal to the number

of vertical stages of the CCD pixels.

In the TDI mode, the signal charges must be transferred in the same direction at the same speed as those of the object to be

imaged. These speeds are expressed by the following equation:

In the right figure, when the first stage charges are transferred

to the second stage, an additional charges are produced in the

second stage by photoelectric conversion and accumulated.

When this operation is continuously repeated until reaching

the last stage M (the number of vertical stages), signal charges

which are M times greater than the initial charges are accumu-

lated. Since the signal charges on each line are output from

the CCD horizontal shift register, a two-dimensional image

can be continuously acquired. In this way the TDI mode

achieves sensitivity which is M times higher than linear image

sensors (S/N is improved

improves sensitivity variations compared to frame mode op-

eration.

Jan. 2007

Operating the back-thinned CCD in TDI mode delivers high sensitivity.

Features

TDI mode gives high sensitivity

High-speed, continuous image acquisition

Back-thinned structure ensures high sensitivity from UV to

near IR

Multiple ports for high-speed line rate

TDI stage

Anti-blooming

Vertical clock

Horizontal clock

Output circuit

Package

Window

S10200-02

S10201-04

S10202-08

S10202-16

v = f × d

Selection guide

Specifications

Type No.

v: Object moving speed, Charge transfer speed, f: Vertical transfer frequency, d: Pixel size

Parameter

Pixel size

12 × 12

(µm)

times). The TDI mode also

1040 × 128

2080 × 128

4160 × 128

4224 × 128

total pixels

Number of

(H) × (V)

TDI (Time Delay Integration) mode

active pixels

1024 × 128

2048 × 128

4096 × 128

Number of

(H) × (V)

Number

of ports

Applications

Sequential imaging of high-speed moving samples

Inspection tasks on electronic parts production line

Semiconductor inspection

Flow cytometery

Two-stage MOSFET source follower

Schematic diagram showing integrated exposure by

TDI mode

FW × 100 (Min.)

(MHz/port)

Pixel rate

Specification

Ceramic DIP

Quarts glass

3 phases

2 phases

Time1

128

Time2

Line rate

(kHz)

100

Time3

Bidirectional

transfer

Vertical

FIRST STAGE

LAST STAGE M

KMPDC0139EA

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