k9f2g08uxa Samsung Semiconductor, Inc., k9f2g08uxa Datasheet - Page 2
k9f2g08uxa
Manufacturer Part Number
k9f2g08uxa
Description
256m X 8 Bit Nand Flash Memory
Manufacturer
Samsung Semiconductor, Inc.
Datasheet
1.K9F2G08UXA.pdf
(44 pages)
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K9F2G08R0A
K9F2G08U0A
Document Title
to change the specifications. SAMSUNG Electronics will evaluate and reply to your requests and questions about device. If you have
any questions, please contact the SAMSUNG branch office near your office.
Revision History
The attached data sheets are prepared and approved by SAMSUNG Electronics. SAMSUNG Electronics CO., LTD. reserve the right
256M x 8 Bit NAND Flash Memory
Revision No
0.0
0.1
0.2
0.3
0.4
1.0
1.1
1.2
1.3
History
1. Initial issue
1. 1.8V part is added.
2. tRHW, tCSD parameter is defined.
3. 4G DDP LGA part is deleted.
4. Technical note is added.(p.18)
1. FBGA package size is changed
2. 1.8V TSOP is deleted
1. 1.8V Ioh/Iol condition is changed
2. Min. tADL @ 3.3V is changed form 70ns to 100ns
1. 1.8V device supports Copy-Back Program
1. 1.8V AC timing is changed
2. tRPB/tRCB/tREAB is added for 1.8V device
1. tCSD is changed.(10ns -> 0ns)
1. tCS 31ns -> 25ns, tREH 15ns -> 10ns (@ 1.8V)
2
FLASH MEMORY
Draft Date
Nov. 09. 2005
Mar. 17th. 06
May 25th 2006
June 1st 2006
June 29th 2006
Aug 23th 2006
Jan. 15th 2007
Mar. 15th 2007
June 4th 2007
Remark
Advance
Advance
Preliminary
Preliminary
Preliminary
Final
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