SI3200-X-FS SILABS [Silicon Laboratories], SI3200-X-FS Datasheet - Page 107

no-image

SI3200-X-FS

Manufacturer Part Number
SI3200-X-FS
Description
Manufacturer
SILABS [Silicon Laboratories]
Datasheet
7. Package Outline: 16-Pin ESOIC
Figure 66 illustrates the package details for the Si3200. Table 53 lists the values for the dimensions shown in the
illustration.
Figure 66. 16-Pin Thermal Enhanced Small Outline Integrated Circuit (ESOIC) Package
16
Seating Plane
1
e
B
D
Table 53. Package Diagram Dimensions
9
8
A1
Exposed Pad
2.3 x 3.6 mm
Bottom Side
γ
Symbol
E
A1
A
B
C
D
E
H
e
h
L
θ
γ
A
H
Rev. 1.2
1.35
9.80
3.80
5.80
Min
.33
.19
.25
.40
0
Millimeters
1.27 BSC
Weight: Approximate device weight is 0.15 grams.
θ
10.00
Max
1.75
0.15
4.00
6.20
1.27
0.10
Detail F
.51
.25
.50
L
h
See Detail F
0.010
C
GAUGE PLANE
Si3220/25
107

Related parts for SI3200-X-FS