emif02-av01f3 STMicroelectronics, emif02-av01f3 Datasheet

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emif02-av01f3

Manufacturer Part Number
emif02-av01f3
Description
Dual Audio And Video Line Ipad, Emi Filter And Esd Protection
Manufacturer
STMicroelectronics
Datasheet

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IPAD
Main application
Description
The EMIF02-AV01F3 is a highly integrated array
designed to suppress EMI / RFI noise and provide
impedance matching for mobile phones and
portable applications.
The EMIF02-AV01F3 is in Flip-chip package to
offer space saving and high RF performance.
Additionally, this low-pass filter includes an ESD
protection circuitry to prevent damage to the
application when subjected to ESD surges up
to 15 kV.
Benefits
Complies with following standards:
IEC 61000-4-2
level 4 on external pin (A2, C2)
level 1 on internal pin (A1, C1)
October 2006
Dual audio and video line interface protection
and filtering in mobile phones
High-density capacitor
EMI low-pass filter and ESD protection
High-efficiency in EMI filtering
Lead-free package
400 µm pitch
Very small PCB footprint: 0.91 mm x 1.31 mm
Very thin package: 0.605 mm
High reliability offered by monolithic integration
Reduction of parasitic elements thanks to CSP
integration
15 kV (air discharge)
8 kV (contact discharge)
2 kV (air discharge)
2 kV (contact discharge)
Rev 2
Pin configuration (Bump side view)
Schematic
Order code
EMI filter and ESD protection
EMIF2-AV01F3
Gnd
Part number
B2
A1
C1
2 kV
2 kV
EMIF02-AV01F3
Flip-Chip
5 Bumps
1
R
R
15 kV
15 kV
2
A
B
C
marking
HH
C
C
C2
www.st.com
A2
1/6
6

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emif02-av01f3 Summary of contents

Page 1

... Main application ■ Dual audio and video line interface protection and filtering in mobile phones Description The EMIF02-AV01F3 is a highly integrated array designed to suppress EMI / RFI noise and provide impedance matching for mobile phones and portable applications. The EMIF02-AV01F3 is in Flip-chip package to offer space saving and high RF performance ...

Page 2

... per line I line line 2/6 = 25° C) amb Parameter = 25° C) amb Parameters RM Test conditions = 30 mV 100 kHz OSC EMIF02-AV01F3 Value 125 200 -40 to +85 -55 to 150 ...

Page 3

... EMIF02-AV01F3 Figure 1. S21 (dB) attenuation dB 0.00 -10.00 -20.00 -30.00 -40.00 F (Hz) -50.00 10.0M 30.0M 100.0M 300.0M Line 1 Figure 3. Digital crosstalk Figure 5. ESD response to IEC 61000-4-2 (-15 kV air discharge) on one input (V ) and one output (V IN Figure 2. 0.00 -10.00 -20.00 -30.00 -40.00 -50.00 -60.00 -70.00 -80.00 -90.00 -100.00 1.0G 3.0G Line 2 Figure 4. Vin = 1 V/d V out = 5 mV/d Figure 6. ) OUT INPUT : 10 V/Div INPUT : 10 V/Div 3.5 100 ns/Div 100 ns/Div 3 ...

Page 4

... Solder mask opening: 300 µm minimum Solder stencil opening: 220 µm recommended 4/6 EMIF yy 400 µm ± 40 255 µm ± 40 910 µm ± 30 µm Figure 9. Dot xx = marking z = manufacturing location yww = datecode (y = year ww = week) EMIF02-AV01F3 - 605 µm ± 55 Marking ...

Page 5

... EMIF02-AV01F3 Figure 10. Flip-chip tape and reel specification All dimensions order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is marked on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...

Page 6

... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 6/6 Please Read Carefully: © 2006 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com EMIF02-AV01F3 ...

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