BU4S71G2-TR Rohm Semiconductor, BU4S71G2-TR Datasheet - Page 15

• Manufacturer Part Number: BU4S71G2-TR
• Description: IC GATE OR SINGLE 5SSOP
• Manufacturer: Rohm Semiconductor
• Series: 4Sr

Specifications of BU4S71G2-TR

• Logic Type: OR Gate
• Number Of Inputs: 2
• Number Of Circuits: 1
• Current - Output High, Low: 3.4mA, 3.4mA
• Voltage - Supply: 3 V ~ 16 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 5-SSOP
• Output Current: 3.4mA
• No. Of Inputs: 2
• Supply Voltage Range: 3V To 16V
• Logic Case Style: SSOP
• No. Of Pins: 5
• Operating Temperature Range: -40°C To +85°C
• Svhc: No SVHC (18-Jun-2010)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

●Notes for use
BU4S01G2,BU4S11G2,BU4SU69G2,BU4S71G2,BU4S81G2, BU4S584G2
© 2009 ROHM Co., Ltd. All rights reserved.
www.rohm.com
1. Absolute Maximum ratings
2. Connecting the power supply connector backward
3. Power supply lines
4. GND voltage
5. Thermal design
6. Inter-pin shorts and mounting errors
7. Actions in strong electromagnetic field
8. Testing on application boards
9. Ground Wiring Pattern
10. Unused input terminals
An excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., can
break down the devices, thus making impossible to identify breaking mode, such as short circuit or an open circuit. If any
over rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as
fuses.
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply
lines. An external direction diode can be added.
Design PCB layout pattern to provide low impedance GND and supply lines. To obtain a low noise ground and supply line,
separate the ground section and supply lines of the digital and analog blocks. Furthermore, for all power supply terminals to
ICs, connect a capacitor between the power supply and the GND terminal. When applying electrolytic capacitors in the
circuit, not that capacitance characteristic values are reduced at low temperatures.
The potential of GND pin must be minimum potential in all operating conditions.
Use a thermal design that allows for a sufficient margin in light of the power dissipation (Pd) in actual operating conditions.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any
connection error or if pins are shorted together.
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to
malfunction.
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC's power supply off before connecting it to or
removing it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure.
Use similar precaution when transporting or storing the IC.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing
a signal ground point at the ground potential of application so that the pattern wiring resistance and voltage variations
caused by large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring
pattern of any external components, either.
Connect all unused input terminals to VDD or VSS in order to prevent excessive current or oscillation.
Insertion of a resistor (100kΩ approx.) is also recommended.
15/16
Technical Note
2009.06 - Rev.A