pbss5320t NXP Semiconductors, pbss5320t Datasheet - Page 3

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pbss5320t

Manufacturer Part Number
pbss5320t
Description
20 V, 3 A Pnp Low Vcesat Biss Transistor
Manufacturer
NXP Semiconductors
Datasheet

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LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
Notes
1. Operated under pulsed conditions: pulse width t
2. Device mounted on a printed-circuit board; single sided copper; tin plated; standard footprint.
3. Device mounted on a printed-circuit board; single sided copper; tin plated; mounting pad for collector 1 cm
4. Device mounted on a printed-circuit board; single sided copper; tin plated; mounting pad for collector 6 cm
THERMAL CHARACTERISTICS
Notes
1. Device mounted on a printed-circuit board; single sided copper; tin plated; standard footprint.
2. Device mounted on a printed-circuit board; single sided copper; tin plated; mounting pad for collector 1 cm
3. Device mounted on a printed-circuit board; single sided copper; tin plated; mounting pad for collector 6 cm
4. Operated under pulsed conditions: pulse width t
2004 Jan 15
V
V
V
I
I
I
I
P
T
T
T
R
SYMBOL
SYMBOL
C
CRP
CM
B
stg
j
amb
CBO
CEO
EBO
tot
th(j-a)
20 V, 3 A
PNP low V
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current (DC)
repetitive peak collector current
peak collector current
base current (DC)
total power dissipation
storage temperature
junction temperature
operating ambient temperature
thermal resistance from junction to
ambient
CEsat
PARAMETER
PARAMETER
(BISS) transistor
open emitter
open base
open collector
note 1
single peak
T
T
T
T
p
in free air; note 1
in free air; note 2
in free air; note 3
in free air; notes 1 and 4
p
amb
amb
amb
amb
100 ms; duty cycle
100 ms; duty cycle
3
25 C; note 2
25 C; note 3
25 C; note 4
25 C; notes 1 and 2
CONDITIONS
CONDITIONS
0.25.
0.25.
65
65
MIN.
VALUE
417
260
230
104
300
480
540
1.2
+150
150
+150
PBSS5320T
Product specification
20
20
5
2
3
5
0.5
MAX.
UNIT
K/W
K/W
K/W
K/W
V
V
V
A
A
A
A
mW
mW
mW
W
C
C
C
2
2
2
2
UNIT
.
.
.
.

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