IR3081AM IRF [International Rectifier], IR3081AM Datasheet - Page 34

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IR3081AM

Manufacturer Part Number
IR3081AM
Description
XPHASETM VR 10 CONTROL IC
Manufacturer
IRF [International Rectifier]
Datasheet
LAYOUT GUIDELINES
The following layout guidelines are recommended to reduce the parasitic inductance and resistance of the PCB
layout, therefore minimizing the noise coupled to the IC.
Dedicate at least one middle layer for a ground plane LGND.
Connect the ground tab under the control IC to LGND plane through a via.
Place the following critical components on the same layer as control IC and position them as close as possible
to the respective pins, R
connection.
Place the compensation components on the same layer as control IC and position them as close as possible to
EAOUT, FB and VDRP pins. Avoid using any via for the connection.
Use Kelvin connections for the remote voltage sense signals, VOSNS+ and VOSNS-, and avoid crossing over
the fast transition nodes, i.e. switching nodes, gate drive signals and bootstrap nodes.
Control bus signals, VDAC, RMPOUT, IIN, VBIAS, and especially EAOUT, should not cross over the fast
transition nodes.
Page 34 of 39
To VIN
To VIN
To
To
LGND
LGND
LGND PLANE
LGND PLANE
OSC
, R
RMPOUT
RMPOUT
OCSET
SS/DEL
SS/DEL
PWRGD
PWRGD
ENABLE
ENABLE
LGND
LGND
VCC
VCC
, R
To SYSTEM
To SYSTEM
VDAC
, C
VDAC
, C
VCC
, and C
VOSNS-
VOSNS-
VDAC
VDAC
ROSC
ROSC
SS/DEL
. Avoid using any via for the
Remote Sense
Remote Sense
To Voltage
To Voltage
IR3081A
1/31
/05

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