IR3081AM IRF [International Rectifier], IR3081AM Datasheet - Page 36

• Manufacturer Part Number: IR3081AM
• Description: XPHASETM VR 10 CONTROL IC
• Manufacturer: IRF [International Rectifier]

Solder Resist
• The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The solder
• The minimum solder resist width is 0.13mm, therefore it is recommended that the solder resist is
• At the inside corner of the solder resist where the lead land groups meet, it is recommended to provide a
• The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
• Ensure that the solder resist in-between the lead lands and the pad land is ≥ 0.15mm due to the high
• The single via in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger than
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resist mis-alignment is a maximum of 0.05mm and it is recommended that the lead lands are all Non
Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD pads.
completely removed from between the lead lands forming a single opening for each “group” of lead
lands.
fillet so a solder resist width of ≥ 0.17mm remains.
the copper of 0.06mm to accommodate solder resist mis-alignment. In 0.5mm pitch cases it is allowable
to have the solder resist opening for the land pad to be smaller than the part pad.
aspect ratio of the solder resist strip separating the lead lands from the pad land.
the diameter of the via.
IR3081A
1/31
/05