UPC1862GS NEC, UPC1862GS Datasheet - Page 30

• Manufacturer Part Number: UPC1862GS
• Description: BURST LOCK CLOCK GENERATOR
• Manufacturer: NEC

RECOMMENDED SOLDERING CONDITIONS
processes are used, or if the soldering is performed under different conditions, please make sure to consult with our sales
offices.
(C10535E).
Surface Mount Device
Caution Apply only one kind of soldering condition to a device, except for “Partial heating method”, or the
30
PC1862GS: 36-pin plastic shrink SOP (300 mil)
Infrared ray reflow
VPS
Wave Soldering
Partial heating method
When soldering this product, it is highly recommended to observe the conditions as shown below. If other soldering
For more details, refer to our document “SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL”
Process
device will be damaged by heat stress.
Peak temperature: 235 C or below (Package surface temperature),
Reflow time: 30 seconds or less (at 210 C or higher),
Maximum number of reflow processes: 2 times.
Peak temperature: 215 C or below (Package surface temperature),
Reflow time: 40 seconds or less (at 200 C or higher),
Maximum number of reflow processes: 2 times.
Solder temperature: 260 C or below, Flow time: 10 seconds or less,
Maximum number of flow process: 1 time,
Pre-heating temperature: 120 C or below (Package surface temperature).
Pin temperature: 300 C or below,
Heat time: 3 seconds or less (Per each side of the device).
Conditions
IR35-00-2
VP15-00-2
WS60-00-1
Symbol
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PC1862