MT47H128M8HQ-37EL MICRON [Micron Technology], MT47H128M8HQ-37EL Datasheet - Page 19

• Manufacturer Part Number: MT47H128M8HQ-37EL
• Description: DDR2 SDRAM
• Manufacturer: MICRON [Micron Technology]

Packaging
Package Dimensions
Figure 8: 84-Ball FBGA Package (8mm x 12.5mm) – x16
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. T 02/10 EN
Solder ball material:
Pb-free – (SAC305) SnAgCu
Pb – (Eutectic) SnPbAg
Dimensions apply to
solder balls post-reflow
on Ø0.35 SMD ball pads.
84X Ø0.45
11.2 CTR
Seating
plane
0.12 A
0.8 TYP
0.8 TYP
Note:
A
9
1. All dimensions are in millimeters.
8
7
6.4 CTR
8 ±0.1
3
2
1
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
0.8 ±0.1
Exposed
gold-plated pad
1.0 MAX X 0.7 NOM
nonconductive floating pad
19
Ball A1 ID
12.5 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging