MT44K16M36 MICRON [Micron Technology], MT44K16M36 Datasheet
MT44K16M36
Manufacturer Part Number
MT44K16M36
Description
576Mb: x18, x36 RLDRAM 3
Manufacturer
MICRON [Micron Technology]
Datasheet
1.MT44K16M36.pdf
(111 pages)
Available stocks
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Company:
Part Number:
MT44K16M36PA-093:A
Manufacturer:
MICRON
Quantity:
4 000
Part Number:
MT44K16M36PA-093E:A
Manufacturer:
MICRON/美光
Quantity:
20 000
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Part Number:
MT44K16M36RB-083F:B
Manufacturer:
MICRON
Quantity:
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Part Number:
MT44K16M36RB-093 ES:A
Manufacturer:
MICRON/美光
Quantity:
20 000
Part Number:
MT44K16M36RB-093 IT:A
Manufacturer:
MICRON/美光
Quantity:
20 000
Company:
Part Number:
MT44K16M36RB-093:A
Manufacturer:
Micron Technology Inc
Quantity:
10 000
Part Number:
MT44K16M36RB-093:A
Manufacturer:
MICRON/美光
Quantity:
20 000
Part Number:
MT44K16M36RB-093E ES:A
Manufacturer:
MICRON/美光
Quantity:
20 000
Company:
Part Number:
MT44K16M36RB-093E IT ES:A
Manufacturer:
MICRON
Quantity:
4 000
Company:
Part Number:
MT44K16M36RB-093E:B
Manufacturer:
MICRON
Quantity:
4 000
Company:
Part Number:
MT44K16M36RB-107E IT:B
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MICRON
Quantity:
4 000
Company:
Part Number:
MT44K16M36RB-125:A
Manufacturer:
Micron Technology Inc
Quantity:
10 000
RLDRAM 3
MT44K32M18 – 2 Meg x 18 x 16 Banks
MT44K16M36 – 1 Meg x 36 x 16 Banks
Features
PDF: 09005aef84003617
576mb_rldram3.pdf – Rev. B 1/12 EN
• 1066 MHz DDR operation (2133 Mb/s/ball data
• 76.8 Gb/s peak bandwidth (x36 at 1066 MHz clock
• Organization
• 1.2V center-terminated push/pull I/O
• 2.5V V
• Reduced cycle time (
• SDR addressing
• Programmable READ/WRITE latency (RL/WL) and
• Data mask for WRITE commands
• Differential input clocks (CK, CK#)
• Free-running differential input data clocks (DKx,
• On-die DLL generates CK edge-aligned data and
• 64ms refresh (128K refresh per 64ms)
• 168-ball FBGA package
• 40Ω or 60Ω matched impedance outputs
• Integrated on-die termination (ODT)
• Single or multibank writes
• Extended operating range (200–1066 MHz)
• READ training register
• Multiplexed and non-multiplexed addressing capa-
• Mirror function
• Output driver and ODT calibration
• JTAG interface (IEEE 1149.1-2001)
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
rate)
frequency)
– 32 Meg x 18, and 16 Meg x 36 common I/O (CIO)
– 16 banks
burst length
DKx#) and output data clocks (QKx, QKx#)
differential output data clock signals
bilities
Micron without notice. Products are only warranted by Micron to meet Micron's production data sheet specifications.
EXT
, 1.35V V
DD
, 1.2V V
t
RC (MIN) = 8 - 12ns)
DDQ
I/O
1
Options
• Clock cycle and
• Configuration
• Operating temperature
• Package
• Revision
– 0.93ns and
– 0.93ns and
– 1.07ns and
– 1.07ns and
– 1.25ns and
– 1.25ns and
– 32 Meg x 18
– 16 Meg x 36
– Commercial (T
– Industrial (T
– 168-ball FBGA
– 168-ball FBGA (Pb-free)
Note:
(RL3-2133)
(RL3-2133)
(RL3-1866)
(RL3-1866)
(RL3-1600)
(RL3-1600)
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1. Not all options listed can be combined to
1
define an offered product. Use the part cat-
alog search on
ble offerings.
t
t
t
t
t
t
RC (MIN) = 8ns
RC (MIN) = 10ns
RC (MIN) = 8ns
RC (MIN) = 10ns
RC (MIN) = 10ns
RC (MIN) = 12ns
576Mb: x18, x36 RLDRAM 3
C
t
RC timing
= –40°C to +95°C)
C
= 0° to +95°C)
www.micron.com
© 2011 Micron Technology, Inc. All rights reserved.
Marking
Features
for availa-
Advance
32M18
16M36
-093E
-107E
-125E
None
-093
-107
-125
PA
RB
IT
:A
‡
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