MT47H128M8HQ-37EL MICRON [Micron Technology], MT47H128M8HQ-37EL Datasheet - Page 20

• Manufacturer Part Number: MT47H128M8HQ-37EL
• Description: DDR2 SDRAM
• Manufacturer: MICRON [Micron Technology]

Figure 9: 60-Ball FBGA Package (8mm x 11.5mm) – x4, x8
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. T 02/10 EN
Solder ball material:
Pb-free – (SAC305) SnAgCu
Pb – (Eutectic) SnPbAg
Dimensions apply to solder
balls post-reflow on
Ø0.35 SMD ball pads.
60X Ø0.45
8 CTR
Seating
0.12 A
plane
0.8 TYP
0.8 TYP
Note:
A
9
1. All dimensions are in millimeters.
8
7
6.4 CTR
8 ±0.1
3
2
1
A
B
C
D
E
F
G
H
J
K
L
Exposed
gold-plated pad
1.0 MAX X 0.7
nonconductive
floating pad
0.8 ±0.1
20
Ball A1 ID
11.5 ±0.1
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.2 MAX
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging