AD9500TE AD [Analog Devices], AD9500TE Datasheet - Page 5

• Manufacturer Part Number: AD9500TE
• Description: Digitally Programmable Delay Generator
• Manufacturer: AD [Analog Devices]

AD9500
Figure 1. System Timing Diagram
DIE LAYOUT
MECHANICAL INFORMATION
Die Dimensions . . . . . . . . . . . . . . . 104
103
18 (max) mils
Pad Dimensions . . . . . . . . . . . . . . . . . . . . . . . 4
4 (min) mils
Metalization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Aluminum
Backing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . None
Substrate Potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .–V
S
Passivation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Oxynitride
Die Attach . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Gold Eutectic
Bond Wire . . . . . . . . 1.25 mil, Aluminum; Ultrasonic Bonding
or 1 mil, Gold; Gold Ball Bonding
REV. D
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