MAX5816 MAXIM [Maxim Integrated Products], MAX5816 Datasheet - Page 2

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MAX5816

Manufacturer Part Number
MAX5816
Description
Ultra-Small, Quad-Channel, 12-Bit Buffered Output DAC with Internal Reference and I2C Interface
Manufacturer
MAXIM [Maxim Integrated Products]
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MAX5816ATB+T
Manufacturer:
MAXIM/美信
Quantity:
20 000
ABSOLUTE MAXIMUM RATINGS
V
OUT_, REF to GND ....0.3V to the lower of (V
SCL, SDA to GND ...................................................-0.3V to +6V
ADDR to GND ........-0.3V to the lower of (V
Continuous Power Dissipation (T
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional opera-
tion of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect device reliability.
PACKAGE THERMAL CHARACTERISTICS (Note 1)
TDFN
Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-
ELECTRICAL CHARACTERISTICS
(V
T
DC PERFORMANCE (Note 3)
Resolution and Monotonicity
Integral Nonlinearity (Note 4)
Differential Nonlinearity (Note 4)
Offset Error (Note 5)
Offset Error Drift
Gain Error (Note 5)
Gain Temperature Coefficient
Zero-Scale Error
Full-Scale Error
DAC OUTPUT CHARACTERISTICS
Output Voltage Range (Note 6)
Ultra-Small, Quad-Channel, 12-Bit Buffered Output DAC
DD
A
DD
TDFN (derate at 24.4mW/NC above 70NC) .............1951.2mW
Junction-to-Ambient Thermal Resistance (θ
Junction-to-Case Thermal Resistance (θ
= +25NC.) (Note 2)
to GND .............................................................-0.3V to +6V
= 2.7V to 5.5V, V
layer board. For detailed information on package thermal considerations, refer to www.maxim-ic.com/thermal-tutorial.
PARAMETER
 Maxim Integrated Products 2
GND
= 0V, C
A
with Internal Reference and I
= +70NC)
SYMBOL
L
DNL
= 200pF, R
INL
OE
GE
N
JC
DD
DD
) .................9NC/W
JA
+ 0.3V) and +6V
+ 0.3V) and +6V
) .........41NC/W
With respect to V
With respect to V
No load
2kI load to GND
2kI load to V
L
= 2kI, T
A
DD
CONDITIONS
= -40NC to +125NC, unless otherwise noted. Typical values are at
REF
REF
Maximum Continuous Current into Any Pin .................... Q50mA
Operating Temperature .................................... -40NC to +125NC
Storage Temperature ....................................... -65NC to +150NC
Lead Temperature (soldering, 10s) ................................+300NC
Soldering Temperature (reflow) .................................... +260NC
MIN
-1.0
-0.5
0.2
12
-1
-1
-5
0
0
0
2
Q0. 5
Q0.2
Q0.5
Q0.1
Q3.0
TYP
Q10
C Interface
MAX5816
V
MAX
+1.0
+0.5
V
V
0.2
DD
+1
+1
+5
10
DD
DD
-
ppm of
UNITS
FV/NC
FS/NC
%FS
%FS
LSB
LSB
Bits
mV
mV
V

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