LAN83C185_03 SMSC [SMSC Corporation], LAN83C185_03 Datasheet - Page 65
LAN83C185_03
Manufacturer Part Number
LAN83C185_03
Description
High Performance Single Chip Low Power 10/100 Ethernet Physical Layer Transceiver
Manufacturer
SMSC [SMSC Corporation]
Datasheet
1.LAN83C185_03.pdf
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High Performance Single Chip Low Power 10/100 Ethernet Physical Layer Transceiver (PHY)
Datasheet
Chapter 7 Package Outline
SMSC LAN83C185
ccc
A1
A2
E1
R2
L1
W
D1
D
H
R
A
E
L
e
θ
Figure 7.1 64 Pin TQFP Package Outline, 10X10X1.4 Body, 2 MM Footprint
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the true position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
11.80
11.80
0.05
1.35
9.80
9.80
0.09
0.45
0.17
0.08
0.08
MIN
0
~
~
~
Maximum mold protrusion is 0.25 mm per side.
o
0.50 Basic
NOMINAL
Table 7.1 64 Pin TQFP Package Parameters
0.60
1.00
0.22
~
~
~
~
~
~
~
~
~
~
~
~
12.20
10.20
12.20
10.20
MAX
1.60
0.15
1.45
0.20
0.75
0.27
0.20
0.08
DATASHEET
7
~
~
o
57
Overall Package Height
Lead Frame Thickness
Lead Shoulder Radius
Lead Foot Length
Lead Foot Radius
Lead Foot Angle
Body Thickness
Lead Length
X body Size
Y body Size
REMARKS
Lead Width
Coplanarity
Lead Pitch
Standoff
X Span
Y Span
Rev. 0.6 (12-12-03)
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