ISL6313 INTERSIL [Intersil Corporation], ISL6313 Datasheet - Page 6

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ISL6313

Manufacturer Part Number
ISL6313
Description
Two-Phase Buck PWM Controller with Integrated MOSFET Drivers for Intel VR11 and AMD Applications
Manufacturer
INTERSIL [Intersil Corporation]
Datasheet

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Absolute Maximum Ratings
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +6V
Supply Voltage, PVCC . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to +15V
BOOT Voltage, V
BOOT to PHASE Voltage, V
PHASE Voltage, V
UGATE Voltage, V
LGATE Voltage, V
Input, Output, or I/O Voltage . . . . . . . . . GND - 0.3V to VCC + 0.3V
ESD Classification . . . . . . . . . . . . . . . . . . . . . . . Class I JEDEC STD
Recommended Operating Conditions
VCC Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +5V ±5%
PVCC Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . +5V to 12V ±5%
Ambient Temperature (ISL6313CRZ) . . . . . . . . . . . . . 0°C to +70°C
Ambient Temperature (ISL6313IRZ) . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Stress above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational section of this specification is not implied.
NOTES:
Electrical Specifications
BIAS SUPPLIES
Input Bias Supply Current
Gate Drive Bias Current - PVCC Pin
VCC POR (Power-On Reset)
Threshold
PVCC POR (Power-On Reset)
Threshold
PWM MODULATOR
Oscillator Frequency Accuracy, F
(ISL6313CRZ)
Oscillator Frequency Accuracy, F
(ISL6313IRZ)
Adjustment Range of Switching
Frequency
Oscillator Ramp Amplitude, V
CONTROL THRESHOLDS
EN Rising Threshold
EN Hysteresis
REFERENCE AND DAC
System Accuracy (1.000V to 1.600V)
System Accuracy (0.600V to 1.000V)
1. θ
2. For θ
3. Parameter magnitude guaranteed by design. Not 100% tested.
GND - 8V (<400ns, 20µJ) to 24V (<200ns, V
Tech Brief TB379.
JA
V
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See
PHASE
JC
, the “case temp” location is the center of the exposed metal pad on the package underside.
PARAMETER
GND - 5V (<100ns Pulse Width, 2µJ) to PVCC + 0.3V
- 3.5V (<100ns Pulse Width, 2µJ) to V
BOOT
LGATE
PHASE
UGATE
. . . . . . . . . . . . . . GND - 0.3V to GND + 36V
. . . . . . . . V
. . . . . . . . . . . GND - 0.3V to PVCC + 0.3V
. . . . . . . GND - 0.3V to 15V (PVCC = 12)
BOOT-PHASE
PP
6
SW
SW
Recommended Operating Conditions, Unless Otherwise Specified.
PHASE
I
I
VCC rising
VCC falling
PVCC rising
PVCC falling
R
R
(Note 3)
(Note 3)
VCC
PVCC
. . . . . . -0.3V to 15V (DC)
-0.3V to 16V (<10ns, 10µJ)
T
T
- 0.3V to V
= 100kΩ (± 0.1%)
= 100kΩ (± 0.1%)
; EN = high
BOOT - PHASE
; EN = high
TEST CONDITIONS
BOOT
BOOT
+ 0.3V
+ 0.3V
= 12V)
ISL6313
ISL6313
Thermal Information
Thermal Resistance
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . .-65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . +300°C
QFN Package (Notes 1, 2) . . . . . . . . . .
4.25
3.75
4.25
3.75
0.08
0.84
MIN
-0.5
-1.0
225
215
10
2
-
-
TYP
4.38
3.87
4.38
3.87
1.50
0.85
250
250
100
4.2
14
-
-
-
θ
JA
(°C/W)
32
MAX
4.50
4.00
4.50
4.00
0.88
275
280
1.0
0.5
1.0
17
6
-
-
θ
March 5, 2007
JC
FN6448.0
2.0
UNITS
(°C/W)
MHz
kHz
kHz
mA
mA
mV
%
%
V
V
V
V
V
V

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