SAF-XE167F-48F66L INFINEON [Infineon Technologies AG], SAF-XE167F-48F66L Datasheet - Page 119

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SAF-XE167F-48F66L

Manufacturer Part Number
SAF-XE167F-48F66L
Description
16-Bit Single-Chip Real Time Signal Controller
Manufacturer
INFINEON [Infineon Technologies AG]
Datasheet

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
SAF-XE167F-48F66L AC
Manufacturer:
Infineon Technologies
Quantity:
10 000
5
In addition to the electrical parameters, the following specifcations ensure proper
integration of the XE167 into the target system.
5.1
These parameters specify the packaging rather than the silicon.
Table 36
Parameter
Exposed Pad Dimension
Power Dissipation
Thermal resistance
Junction-Ambient
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) or a 4-layer board without thermal vias;
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
Data Sheet
exposed pad not soldered.
soldered.
to the board.
Package and Reliability
Packaging
Package Parameters (PG-LQFP-144-4)
Symbol
Ex × Ey –
P
R
DISS
ΘJA
Min.
117
Limit Values
Max.
6.5 × 6.5
1.0
45
36
22
XE166 Family Derivatives
Package and Reliability
Unit Notes
mm –
W
K/W No thermal via
K/W 4-layer, no pad
K/W 4-layer, pad
V2.1, 2008-08
XE167x
3)
1)
2)

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